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Hybrid data mining approach for pattern extraction from wafer bin map to improve yield in semiconductor manufacturing

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  • Hsu, Shao-Chung
  • Chien, Chen-Fu

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  • Hsu, Shao-Chung & Chien, Chen-Fu, 2007. "Hybrid data mining approach for pattern extraction from wafer bin map to improve yield in semiconductor manufacturing," International Journal of Production Economics, Elsevier, vol. 107(1), pages 88-103, May.
    • Handle: RePEc:eee:proeco:v:107:y:2007:i:1:p:88-103
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    References listed on IDEAS

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    1. G. V. Kass, 1980. "An Exploratory Technique for Investigating Large Quantities of Categorical Data," Journal of the Royal Statistical Society Series C, Royal Statistical Society, vol. 29(2), pages 119-127, June.
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    Cited by:

    1. Chen-Fu Chien & Hsin-Jung Wu, 2024. "Integrated circuit probe card troubleshooting based on rough set theory for advanced quality control and an empirical study," Journal of Intelligent Manufacturing, Springer, vol. 35(1), pages 275-287, January.
    2. Chia-Yu Hsu & Ju-Chien Chien, 2022. "Ensemble convolutional neural networks with weighted majority for wafer bin map pattern classification," Journal of Intelligent Manufacturing, Springer, vol. 33(3), pages 831-844, March.
    3. Wenhan Fu & Chen-Fu Chien & Lizhen Tang, 2022. "Bayesian network for integrated circuit testing probe card fault diagnosis and troubleshooting to empower Industry 3.5 smart production and an empirical study," Journal of Intelligent Manufacturing, Springer, vol. 33(3), pages 785-798, March.
    4. Eduardo Oliveira & Vera L. Miguéis & José L. Borges, 2023. "Automatic root cause analysis in manufacturing: an overview & conceptualization," Journal of Intelligent Manufacturing, Springer, vol. 34(5), pages 2061-2078, June.
    5. Chen-Fu Chien & Chiao-Wen Liu & Shih-Chung Chuang, 2017. "Analysing semiconductor manufacturing big data for root cause detection of excursion for yield enhancement," International Journal of Production Research, Taylor & Francis Journals, vol. 55(17), pages 5095-5107, September.
    6. Fan, Shu-Kai S. & Chiu, Shang-Hao, 2024. "A new ViT-Based augmentation framework for wafer map defect classification to enhance the resilience of semiconductor supply chains," International Journal of Production Economics, Elsevier, vol. 273(C).
    7. Tongwha Kim & Kamran Behdinan, 2023. "Advances in machine learning and deep learning applications towards wafer map defect recognition and classification: a review," Journal of Intelligent Manufacturing, Springer, vol. 34(8), pages 3215-3247, December.
    8. Dutta, Debprotim & Bose, Indranil, 2015. "Managing a Big Data project: The case of Ramco Cements Limited," International Journal of Production Economics, Elsevier, vol. 165(C), pages 293-306.
    9. Chen-Fu Chien & Chung-Jen Kuo & Chih-Min Yu, 2020. "Tool allocation to smooth work-in-process for cycle time reduction and an empirical study," Annals of Operations Research, Springer, vol. 290(1), pages 1009-1033, July.

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