IDEAS home Printed from https://ideas.repec.org/a/spr/joinma/v32y2021i1d10.1007_s10845-020-01570-5.html
   My bibliography  Save this article

Intelligent manufacturing Lie Group Machine Learning: real-time and efficient inspection system based on fog computing

Author

Listed:
  • Chengjun Xu

    (Wuhan University)

  • Guobin Zhu

    (Wuhan University)

Abstract

Due to the improvement of network infrastructure and the application of Internet of Things equipment, a large number of sensors are deployed in the industrial pipeline production, and the large size of data is generated. The most typical case in the production line is product inspection, that is, defect inspection. To implement an efficient and robust detection system, in this study, we propose a classification computing model based on Lie Group Machine Learning, which can find the possible defective products in production. Usually, a workshop has a lot of assembly lines. How to process large data on so many production lines in real-time and accurately is a difficult problem. To solve this problem, we use the concept of fog computing to design the system. By offloading the computation burden from the cloud server center to the fog nodes, the system obtains the ability to deal with extremely data. Our system has two obvious advantages. The first one is to apply Lie Group Machine Learning to fog computing environment to improve the computational efficiency and robustness of the system. The other is that without increasing any production costs, it can quickly detect products, reduce network latency, and reduce the load on bandwidth. The simulations prove that, compared with the existing methods, the proposed method has an average running efficiency increase of 52.57%, an average delay reduction of 42.13%, and an average accuracy increase of 27.86%.

Suggested Citation

  • Chengjun Xu & Guobin Zhu, 2021. "Intelligent manufacturing Lie Group Machine Learning: real-time and efficient inspection system based on fog computing," Journal of Intelligent Manufacturing, Springer, vol. 32(1), pages 237-249, January.
    • Handle: RePEc:spr:joinma:v:32:y:2021:i:1:d:10.1007_s10845-020-01570-5
    DOI: 10.1007/s10845-020-01570-5
    as

    Download full text from publisher

    File URL: http://link.springer.com/10.1007/s10845-020-01570-5
    File Function: Abstract
    Download Restriction: Access to the full text of the articles in this series is restricted.
    File URL: https://libkey.io/10.1007/s10845-020-01570-5?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    References listed on IDEAS

    as
    1. Hui Lin & Bin Li & Xinggang Wang & Yufeng Shu & Shuanglong Niu, 2019. "Automated defect inspection of LED chip using deep convolutional neural network," Journal of Intelligent Manufacturing, Springer, vol. 30(6), pages 2525-2534, August.
    2. Cheng Hao Jin & Hyun-Jin Kim & Yongjun Piao & Meijing Li & Minghao Piao, 2020. "Wafer map defect pattern classification based on convolutional neural network features and error-correcting output codes," Journal of Intelligent Manufacturing, Springer, vol. 31(8), pages 1861-1875, December.
    Full references (including those not matched with items on IDEAS)

    Citations

    Citations are extracted by the CitEc Project, subscribe to its RSS feed for this item.
    as


    Cited by:

    1. Jinfeng Liu & Qiukai Ji & Xiaohu Zhang & Yu Chen & Yiming Zhang & Xiaojun Liu & Mingming Tang, 2024. "Digital twin model-driven capacity evaluation and scheduling optimization for ship welding production line," Journal of Intelligent Manufacturing, Springer, vol. 35(7), pages 3353-3375, October.

    Most related items

    These are the items that most often cite the same works as this one and are cited by the same works as this one.
    1. Chia-Yu Hsu & Ju-Chien Chien, 2022. "Ensemble convolutional neural networks with weighted majority for wafer bin map pattern classification," Journal of Intelligent Manufacturing, Springer, vol. 33(3), pages 831-844, March.
    2. Feng Huang & Ben-wu Wang & Qi-peng Li & Jun Zou, 2023. "Texture surface defect detection of plastic relays with an enhanced feature pyramid network," Journal of Intelligent Manufacturing, Springer, vol. 34(3), pages 1409-1425, March.
    3. Bikash Koli Dey & Hyesung Seok, 2024. "Intelligent inventory management with autonomation and service strategy," Journal of Intelligent Manufacturing, Springer, vol. 35(1), pages 307-330, January.
    4. Cheng Hao Jin & Hyun-Jin Kim & Yongjun Piao & Meijing Li & Minghao Piao, 2020. "Wafer map defect pattern classification based on convolutional neural network features and error-correcting output codes," Journal of Intelligent Manufacturing, Springer, vol. 31(8), pages 1861-1875, December.
    5. Shuo Meng & Ruru Pan & Weidong Gao & Jian Zhou & Jingan Wang & Wentao He, 2021. "A multi-task and multi-scale convolutional neural network for automatic recognition of woven fabric pattern," Journal of Intelligent Manufacturing, Springer, vol. 32(4), pages 1147-1161, April.
    6. Diyi Zhou & Shihua Gong & Ziyue Wang & Delong Li & Huaiqing Lu, 2021. "Error analysis based on error transfer theory and compensation strategy for LED chip visual localization systems," Journal of Intelligent Manufacturing, Springer, vol. 32(5), pages 1345-1359, June.
    7. Yuwei Mao & Hui Lin & Christina Xuan Yu & Roger Frye & Darren Beckett & Kevin Anderson & Lars Jacquemetton & Fred Carter & Zhangyuan Gao & Wei-keng Liao & Alok N. Choudhary & Kornel Ehmann & Ankit Agr, 2023. "A deep learning framework for layer-wise porosity prediction in metal powder bed fusion using thermal signatures," Journal of Intelligent Manufacturing, Springer, vol. 34(1), pages 315-329, January.
    8. Swarit Anand Singh & K. A. Desai, 2023. "Automated surface defect detection framework using machine vision and convolutional neural networks," Journal of Intelligent Manufacturing, Springer, vol. 34(4), pages 1995-2011, April.
    9. Minghao Piao & Cheng Hao Jin, 2023. "CNN and ensemble learning based wafer map failure pattern recognition based on local property based features," Journal of Intelligent Manufacturing, Springer, vol. 34(8), pages 3599-3621, December.
    10. Minyoung Lee & Joohyoung Jeon & Hongchul Lee, 2022. "Explainable AI for domain experts: a post Hoc analysis of deep learning for defect classification of TFT–LCD panels," Journal of Intelligent Manufacturing, Springer, vol. 33(6), pages 1747-1759, August.
    11. Feiyang Li & Nian Cai & Xueliang Deng & Jiahao Li & Jianfa Lin & Han Wang, 2022. "Serial number inspection for ceramic membranes via an end-to-end photometric-induced convolutional neural network framework," Journal of Intelligent Manufacturing, Springer, vol. 33(5), pages 1373-1392, June.
    12. Ruizhen Liu & Zhiyi Sun & Anhong Wang & Kai Yang & Yin Wang & Qianlai Sun, 2020. "Real-time defect detection network for polarizer based on deep learning," Journal of Intelligent Manufacturing, Springer, vol. 31(8), pages 1813-1823, December.
    13. Tongwha Kim & Kamran Behdinan, 2023. "Advances in machine learning and deep learning applications towards wafer map defect recognition and classification: a review," Journal of Intelligent Manufacturing, Springer, vol. 34(8), pages 3215-3247, December.
    14. Omid Davtalab & Ali Kazemian & Xiao Yuan & Behrokh Khoshnevis, 2022. "Automated inspection in robotic additive manufacturing using deep learning for layer deformation detection," Journal of Intelligent Manufacturing, Springer, vol. 33(3), pages 771-784, March.
    15. Aidong Chen & Xiang Li & Hongyuan Jing & Chen Hong & Minghai Li, 2023. "Anomaly Detection Algorithm for Photovoltaic Cells Based on Lightweight Multi-Channel Spatial Attention Mechanism," Energies, MDPI, vol. 16(4), pages 1-15, February.
    16. Zhenxing Cheng & Hu Wang & Gui-Rong Liu, 2021. "Deep convolutional neural network aided optimization for cold spray 3D simulation based on molecular dynamics," Journal of Intelligent Manufacturing, Springer, vol. 32(4), pages 1009-1023, April.
    17. Nhat-To Huynh & Duong-Dong Ho & Hong-Nguyen Nguyen, 2023. "An Approach for Designing an Optimal CNN Model Based on Auto-Tuning GA with 2D Chromosome for Defect Detection and Classification," Sustainability, MDPI, vol. 15(6), pages 1-14, March.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:spr:joinma:v:32:y:2021:i:1:d:10.1007_s10845-020-01570-5. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    If CitEc recognized a bibliographic reference but did not link an item in RePEc to it, you can help with this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Sonal Shukla or Springer Nature Abstracting and Indexing (email available below). General contact details of provider: http://www.springer.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.