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Simultaneous enhancement of strength and conductivity via self-assembled lamellar architecture

Author

Listed:
  • Tielong Han

    (Beijing University of Technology)

  • Chao Hou

    (Beijing University of Technology)

  • Zhi Zhao

    (Beijing University of Technology)

  • Zengbao Jiao

    (The Hong Kong Polytechnic University)

  • Yurong Li

    (Beijing University of Technology)

  • Shuang Jiang

    (Northeastern University)

  • Hao Lu

    (Beijing University of Technology)

  • Haibin Wang

    (Beijing University of Technology)

  • Xuemei Liu

    (Beijing University of Technology)

  • Zuoren Nie

    (Beijing University of Technology)

  • Xiaoyan Song

    (Beijing University of Technology)

Abstract

Simultaneous improvement of strength and conductivity is urgently demanded but challenging for bimetallic materials. Here we show by creating a self-assembled lamellar (SAL) architecture in W-Cu system, enhancement in strength and electrical conductivity is able to be achieved at the same time. The SAL architecture features alternately stacked Cu layers and W lamellae containing high-density dislocations. This unique layout not only enables predominant stress partitioning in the W phase, but also promotes hetero-deformation induced strengthening. In addition, the SAL architecture possesses strong crack-buffering effect and damage tolerance. Meanwhile, it provides continuous conducting channels for electrons and reduces interface scattering. As a result, a yield strength that doubles the value of the counterpart, an increased electrical conductivity, and a large plasticity were achieved simultaneously in the SAL W-Cu composite. This study proposes a flexible strategy of architecture design and an effective method for manufacturing bimetallic composites with excellent integrated properties.

Suggested Citation

  • Tielong Han & Chao Hou & Zhi Zhao & Zengbao Jiao & Yurong Li & Shuang Jiang & Hao Lu & Haibin Wang & Xuemei Liu & Zuoren Nie & Xiaoyan Song, 2024. "Simultaneous enhancement of strength and conductivity via self-assembled lamellar architecture," Nature Communications, Nature, vol. 15(1), pages 1-11, December.
    • Handle: RePEc:nat:natcom:v:15:y:2024:i:1:d:10.1038_s41467-024-46029-w
    DOI: 10.1038/s41467-024-46029-w
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    References listed on IDEAS

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