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A solvent-free processed low-temperature tolerant adhesive

Author

Listed:
  • Xiaoming Xie

    (South China Normal University
    Xinzhou Normal University)

  • Yulian Jiang

    (Xinzhou Normal University)

  • Xiaoman Yao

    (South China Normal University)

  • Jiaqi Zhang

    (Taiyuan University of Technology)

  • Zilin Zhang

    (Xinzhou Normal University)

  • Taoping Huang

    (South China Normal University)

  • Runhan Li

    (South China Normal University)

  • Yifa Chen

    (South China Normal University)

  • Shun-Li Li

    (South China Normal University)

  • Ya-Qian Lan

    (South China Normal University)

Abstract

Ultra-low temperature resistant adhesive is highly desired yet scarce for material adhesion for the potential usage in Arctic/Antarctic or outer space exploration. Here we develop a solvent-free processed low-temperature tolerant adhesive with excellent adhesion strength and organic solvent stability, wide tolerable temperature range (i.e. −196 to 55 °C), long-lasting adhesion effect ( > 60 days, −196 °C) that exceeds the classic commercial hot melt adhesives. Furthermore, combine experimental results with theoretical calculations, the strong interaction energy between polyoxometalate and polymer is the main factor for the low-temperature tolerant adhesive, possessing enhanced cohesion strength, suppressed polymer crystallization and volumetric contraction. Notably, manufacturing at scale can be easily achieved by the facile scale-up solvent-free processing, showing much potential towards practical application in Arctic/Antarctic or planetary exploration.

Suggested Citation

  • Xiaoming Xie & Yulian Jiang & Xiaoman Yao & Jiaqi Zhang & Zilin Zhang & Taoping Huang & Runhan Li & Yifa Chen & Shun-Li Li & Ya-Qian Lan, 2024. "A solvent-free processed low-temperature tolerant adhesive," Nature Communications, Nature, vol. 15(1), pages 1-8, December.
    • Handle: RePEc:nat:natcom:v:15:y:2024:i:1:d:10.1038_s41467-024-49503-7
    DOI: 10.1038/s41467-024-49503-7
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    References listed on IDEAS

    as
    1. Guangxu Yang & Zhenggang Gong & Xiaolin Luo & Lihui Chen & Li Shuai, 2023. "Bonding wood with uncondensed lignins as adhesives," Nature, Nature, vol. 621(7979), pages 511-515, September.
    2. Séverine Rose & Alexandre Prevoteau & Paul Elzière & Dominique Hourdet & Alba Marcellan & Ludwik Leibler, 2014. "Nanoparticle solutions as adhesives for gels and biological tissues," Nature, Nature, vol. 505(7483), pages 382-385, January.
    3. Chao Ma & Jing Sun & Bo Li & Yang Feng & Yao Sun & Li Xiang & Baiheng Wu & Lingling Xiao & Baimei Liu & Vladislav S. Petrovskii & Liu & Jinrui Zhang & Zili Wang & Hongyan Li & Lei Zhang & Jingjing Li , 2021. "Ultra-strong bio-glue from genetically engineered polypeptides," Nature Communications, Nature, vol. 12(1), pages 1-14, December.
    4. Clayton R. Westerman & Bradley C. McGill & Jonathan J. Wilker, 2023. "Sustainably sourced components to generate high-strength adhesives," Nature, Nature, vol. 621(7978), pages 306-311, September.
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