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Power-saving exploration for high-end ultra-slim laptop computers with miniature loop heat pipe cooling module

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  • Zhou, Guohui
  • Li, Ji
  • Jia, Zizhou

Abstract

In this paper, an active air-cooling module based on a 1-mm-thick ultrathin miniature loop heat pipe with a flat evaporator for high-end ultra-slim laptop computers is presented and studied. Systematic experimental investigations were conducted under natural air convection and forced air cooling conditions with different fan voltages. The results indicated that the miniature loop heat pipe module could effectively dissipate a heat load of 12 W at all test orientations under natural convection with zero power consumption when the chip-junction temperatures were below 85 °C. Under forced air cooling, the proposed miniature loop heat pipe module had almost identical cooling performance at all test orientations when the fan input voltages were changed from 5 V to 2 V. Aided by infrared photography and theoretical analysis, the unique operation mechanism for the module was revealed. Finally, in a 35 °C temperature humidity chamber, the module could dissipate 25 W at a fan voltage of 5 V (22 W at 2 V) with the chip-junction temperature below 85 °C, showing a promising and energy-saving thermal management solution for high-end ultra-slim laptop computers. The results indicate that by using the proposed module, cooling energy savings of up to 80% could be realized compared to the current applied miniature heat pipe module in a laptop computer.

Suggested Citation

  • Zhou, Guohui & Li, Ji & Jia, Zizhou, 2019. "Power-saving exploration for high-end ultra-slim laptop computers with miniature loop heat pipe cooling module," Applied Energy, Elsevier, vol. 239(C), pages 859-875.
    • Handle: RePEc:eee:appene:v:239:y:2019:i:c:p:859-875
    DOI: 10.1016/j.apenergy.2019.01.258
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    References listed on IDEAS

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    1. Tang, Heng & Tang, Yong & Wan, Zhenping & Li, Jie & Yuan, Wei & Lu, Longsheng & Li, Yong & Tang, Kairui, 2018. "Review of applications and developments of ultra-thin micro heat pipes for electronic cooling," Applied Energy, Elsevier, vol. 223(C), pages 383-400.
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    4. Zhang, Xingxing & Zhao, Xudong & Xu, Jihuan & Yu, Xiaotong, 2013. "Characterization of a solar photovoltaic/loop-heat-pipe heat pump water heating system," Applied Energy, Elsevier, vol. 102(C), pages 1229-1245.
    5. Chernysheva, M.A. & Yushakova, S.I. & Maydanik, Yu.F., 2014. "Copper–water loop heat pipes for energy-efficient cooling systems of supercomputers," Energy, Elsevier, vol. 69(C), pages 534-542.
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    Cited by:

    1. Yongle Tang & Xuewei Zhang & Zhichun Liu, 2023. "Experimental Study on the Thermal Performance of Flat Loop Heat Pipe Applied in Data Center Cooling," Energies, MDPI, vol. 16(12), pages 1-21, June.
    2. Sijun Xu & Hua Zhang & Zilong Wang, 2023. "Thermal Management and Energy Consumption in Air, Liquid, and Free Cooling Systems for Data Centers: A Review," Energies, MDPI, vol. 16(3), pages 1-25, January.
    3. Tian, Tong & Wang, Xinyue & Liu, Yang & Yang, Xuan & Sun, Bo & Li, Ji, 2023. "Nano-engineering enabled heat pipe battery: A powerful heat transfer infrastructure with capability of power generation," Applied Energy, Elsevier, vol. 348(C).
    4. Marco Bernagozzi & Nicolas Miché & Anastasios Georgoulas & Cedric Rouaud & Marco Marengo, 2021. "Performance of an Environmentally Friendly Alternative Fluid in a Loop Heat Pipe-Based Battery Thermal Management System," Energies, MDPI, vol. 14(22), pages 1-19, November.
    5. Wang, Xinyue & Liu, Yang & Tian, Tong & Li, Ji, 2022. "Directly air-cooled compact looped heat pipe module for high power servers with extremely low power usage effectiveness," Applied Energy, Elsevier, vol. 319(C).
    6. Jiwen Cen & Feng Li & Tingliang Li & Wenbo Huang & Juanwen Chen & Fangming Jiang, 2021. "Experimental Study of the Heat-Transfer Performance of an Extra-Long Gravity-Assisted Heat Pipe Aiming at Geothermal Heat Exploitation," Sustainability, MDPI, vol. 13(22), pages 1-16, November.

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