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Directly air-cooled compact looped heat pipe module for high power servers with extremely low power usage effectiveness

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  • Wang, Xinyue
  • Liu, Yang
  • Tian, Tong
  • Li, Ji

Abstract

The rapid development of data centers has brought huge energy consumption around the world, and an effective, reliable and energy-saving cooling method is urgently demanded for data centers cooling. This paper proposed air directly cooling looped heat pipe (LHP) modules with excellent thermal performance that can be used for server cooling in data centers based on the unconventional enhancement mechanism for looped heat pipes. The proposed LHP with no compensation chamber has an auxiliary wick which connects the primary wick in the evaporator and extends into the condenser to promote the liquid replenishing. Meanwhile, another approach for reducing the sensible heat leak in the replenishing liquid was introduced with aid of an additional fin and fan assembly installed very close to the evaporator entrance. By means of the above approaches, significant improvement in maximum sustainable heat load of the LHP in horizontal direction was achieved. The improved LHP module has a maximum heat dissipation capacity of 550 W with the minimum total thermal resistance of 0.16 °C/W in horizontal direction, and with a power usage effectiveness as low as 1.02.

Suggested Citation

  • Wang, Xinyue & Liu, Yang & Tian, Tong & Li, Ji, 2022. "Directly air-cooled compact looped heat pipe module for high power servers with extremely low power usage effectiveness," Applied Energy, Elsevier, vol. 319(C).
    • Handle: RePEc:eee:appene:v:319:y:2022:i:c:s0306261922006365
    DOI: 10.1016/j.apenergy.2022.119279
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    References listed on IDEAS

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    1. Zhou, Guohui & Li, Ji & Jia, Zizhou, 2019. "Power-saving exploration for high-end ultra-slim laptop computers with miniature loop heat pipe cooling module," Applied Energy, Elsevier, vol. 239(C), pages 859-875.
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    Citations

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    Cited by:

    1. Zhang, Hainan & Tian, Yaling & Tian, Changqing & Zhai, Zhiqiang, 2023. "Effect of key structure and working condition parameters on a compact flat-evaporator loop heat pipe for chip cooling of data centers," Energy, Elsevier, vol. 284(C).
    2. Hong, Wenpeng & Mu, Yuhan & Lan, Jingrui & Jin, Xu & Wang, Xinzhi & Li, Haoran, 2024. "Improving vapor condensation via copper foam in capillary-fed photovoltaic membrane distillation," Energy, Elsevier, vol. 296(C).
    3. Tian, Tong & Wang, Xinyue & Liu, Yang & Yang, Xuan & Sun, Bo & Li, Ji, 2023. "Nano-engineering enabled heat pipe battery: A powerful heat transfer infrastructure with capability of power generation," Applied Energy, Elsevier, vol. 348(C).
    4. Rickard Brännvall & Jonas Gustafsson & Fredrik Sandin, 2023. "Modular and Transferable Machine Learning for Heat Management and Reuse in Edge Data Centers," Energies, MDPI, vol. 16(5), pages 1-24, February.
    5. Zhou, Haojie & Tian, Tong & Wang, Xinyue & Li, Ji, 2023. "Combining looped heat pipe and thermoelectric generator module to pursue data center servers with possible power usage effectiveness less than 1," Applied Energy, Elsevier, vol. 332(C).

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