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Modeling of the Electrical and Thermal Behaviors of an Ultracapacitor

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Listed:
  • Jeongbin Lee

    (Department of Energy Systems Research, Ajou University, Suwon 443-749, Korea)

  • Jaeshin Yi

    (Department of Energy Systems Research, Ajou University, Suwon 443-749, Korea)

  • Daeyong Kim

    (Department of Energy Systems Research, Ajou University, Suwon 443-749, Korea)

  • Chee Burm Shin

    (Department of Energy Systems Research, Ajou University, Suwon 443-749, Korea)

  • Kyung-Seok Min

    (Manufacturing Technology Center, LS Mtron Ltd., Gunpo 435-831, Korea)

  • Jongrak Choi

    (Manufacturing Technology Center, LS Mtron Ltd., Gunpo 435-831, Korea)

  • Ha-Young Lee

    (Ultracapacitor (UC) Team/R&D, LS Mtron Ltd., Anyang 431-831, Korea)

Abstract

This paper reports a modeling methodology to predict the electrical and thermal behaviors of a 2.7 V/650 F ultracapacitor (UC) cell from LS Mtron Ltd. (Anyang, Korea). The UC cell is subject to the charge/discharge cycling with constant-current between 1.35 V and 2.7 V. The charge/discharge current values examined are 50, 100, 150, and 200 A. A three resistor-capacitor (RC) parallel branch model is employed to calculate the electrical behavior of the UC. The modeling results for the variations of the UC cell voltage as a function of time for various charge/discharge currents are in good agreement with the experimental measurements. A three-dimensional thermal model is presented to predict the thermal behavior of the UC. Both of the irreversible and reversible heat generations inside the UC cell are considered. The validation of the three-dimensional thermal model is provided through the comparison of the modeling results with the experimental infrared (IR) image at various charge/discharge currents. A zero-dimensional thermal model is proposed to reduce the significant computational burden required for the three-dimensional thermal model. The zero-dimensional thermal model appears to generate the numerical results accurate enough to resolve the thermal management issues related to the UC for automotive applications without relying on significant computing resources.

Suggested Citation

  • Jeongbin Lee & Jaeshin Yi & Daeyong Kim & Chee Burm Shin & Kyung-Seok Min & Jongrak Choi & Ha-Young Lee, 2014. "Modeling of the Electrical and Thermal Behaviors of an Ultracapacitor," Energies, MDPI, vol. 7(12), pages 1-15, December.
    • Handle: RePEc:gam:jeners:v:7:y:2014:i:12:p:8264-8278:d:43364
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    References listed on IDEAS

    as
    1. Wang, Kai & Zhang, Li & Ji, Bingcheng & Yuan, Jinlei, 2013. "The thermal analysis on the stackable supercapacitor," Energy, Elsevier, vol. 59(C), pages 440-444.
    2. Burke, Andrew, 2000. "Ultracapacitors: Why, How, and Where is the Technology," Institute of Transportation Studies, Working Paper Series qt9n905017, Institute of Transportation Studies, UC Davis.
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    Cited by:

    1. Henry Miniguano & Andrés Barrado & Cristina Fernández & Pablo Zumel & Antonio Lázaro, 2019. "A General Parameter Identification Procedure Used for the Comparative Study of Supercapacitors Models," Energies, MDPI, vol. 12(9), pages 1-20, May.
    2. Wang, Chun & He, Hongwen & Zhang, Yongzhi & Mu, Hao, 2017. "A comparative study on the applicability of ultracapacitor models for electric vehicles under different temperatures," Applied Energy, Elsevier, vol. 196(C), pages 268-278.

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