IDEAS home Printed from https://ideas.repec.org/a/gam/jeners/v16y2023i21p7228-d1266220.html
   My bibliography  Save this article

Enhancement Effect of a Diamond Network on the Flow Boiling Heat Transfer Characteristics of a Diamond/Cu Heat Sink

Author

Listed:
  • Nan Wu

    (State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China
    GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China
    General Research Institute for Nonferrous Metals, Beijing 100088, China)

  • Mingmei Sun

    (State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China
    GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China
    General Research Institute for Nonferrous Metals, Beijing 100088, China)

  • Hong Guo

    (State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China
    GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China
    General Research Institute for Nonferrous Metals, Beijing 100088, China)

  • Zhongnan Xie

    (State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China
    GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China
    General Research Institute for Nonferrous Metals, Beijing 100088, China)

  • Shijie Du

    (State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China
    GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China
    General Research Institute for Nonferrous Metals, Beijing 100088, China)

Abstract

The use of a micro heat sink is an effective means of solving the problem of high-power chip heat dissipation. Diamond/Cu composites exhibit high thermal conductivity and a linear thermal expansion coefficient that is compatible with semiconductor materials, rendering them ideal micro heat sink materials. The aim of this study was to fabricate diamond/Cu and Cu separately as heat sinks and subject them to flow boiling heat transfer experiments. The results indicate that the diamond/Cu heat sink displayed a decrease in wall superheat of 10.2–14.5 °C and an improvement in heat transfer coefficient of 38–51% compared with the Cu heat sink under identical heat fluxes. The heat sink also exhibits enhanced thermal uniformity. Secondary diamond particles are incorporated into the gaps of the main diamonds, thereby constructing a three-dimensional heat conduction network within the composite material. The diamond network enhances the internal heat flux of the material while also creating more nucleation sites on the surface. These increase the boiling intensity of the diamond/Cu heat sink, leading to better heat transfer performance. By combining the transient thermal model with computational fluid dynamics, a heat transfer model based on the diamond/Cu heat sink is proposed. The efficient heat dissipation capability of diamond/Cu heat sinks can lower the working temperature of microelectronic devices, thereby improving device performance and reliability during operation.

Suggested Citation

  • Nan Wu & Mingmei Sun & Hong Guo & Zhongnan Xie & Shijie Du, 2023. "Enhancement Effect of a Diamond Network on the Flow Boiling Heat Transfer Characteristics of a Diamond/Cu Heat Sink," Energies, MDPI, vol. 16(21), pages 1-17, October.
    • Handle: RePEc:gam:jeners:v:16:y:2023:i:21:p:7228-:d:1266220
    as

    Download full text from publisher

    File URL: https://www.mdpi.com/1996-1073/16/21/7228/pdf
    Download Restriction: no
    File URL: https://www.mdpi.com/1996-1073/16/21/7228/
    Download Restriction: no
    ---><---

    References listed on IDEAS

    as
    1. Remco Erp & Reza Soleimanzadeh & Luca Nela & Georgios Kampitsis & Elison Matioli, 2020. "Co-designing electronics with microfluidics for more sustainable cooling," Nature, Nature, vol. 585(7824), pages 211-216, September.
    Full references (including those not matched with items on IDEAS)

    Most related items

    These are the items that most often cite the same works as this one and are cited by the same works as this one.
    1. Liu, H.R. & Li, B.J. & Hua, L.J. & Wang, R.Z., 2022. "Designing thermoelectric self-cooling system for electronic devices: Experimental investigation and model validation," Energy, Elsevier, vol. 243(C).
    2. Shuhuan Wei & Dini Wang, 2023. "Improvement of Constructal Optimization for “Volume-Point” Heat Conduction Based on Uniformity Principle of Temperature Difference Fields," Mathematics, MDPI, vol. 11(16), pages 1-14, August.
    3. Yunfeng Li & Zhihui Xie & Daoguang Lin & Zhuoqun Lu & Yanlin Ge, 2023. "Constructal Optimizations of Liquid-Cooled Channels with Triangle or Square Sections in a Cylindrical Heating Body," Mathematics, MDPI, vol. 11(2), pages 1-18, January.
    4. Xiao, Lei & Luo, Kaiqi & Zhao, Dong & Wu, Zhanghua & Xu, Jingyuan & Luo, Ercang, 2024. "A highly efficient heat-driven thermoacoustic cooling system: Detailed study," Energy, Elsevier, vol. 293(C).
    5. Rui, Ziliang & Sun, Hong & Ma, Jie & Peng, Hao, 2023. "Experimental study and prediction on the thermal management performance of SDS aqueous solution based microchannel flow boiling system," Energy, Elsevier, vol. 282(C).
    6. Cong Wang & Yalong Kong & Zhigang Liu & Lin Guo & Yawei Yang, 2023. "A Novel Pressure-Controlled Molecular Dynamics Simulation Method for Nanoscale Boiling Heat Transfer," Energies, MDPI, vol. 16(5), pages 1-13, February.
    7. Krzysztof Dziarski & Arkadiusz Hulewicz & Grzegorz Dombek & Łukasz Drużyński, 2022. "Indirect Thermographic Temperature Measurement of a Power-Rectifying Diode Die," Energies, MDPI, vol. 15(9), pages 1-17, April.
    8. Xu Wang & Pallav Purohit, 2022. "Transitioning to low-GWP alternatives with enhanced energy efficiency in cooling non-residential buildings of China," Mitigation and Adaptation Strategies for Global Change, Springer, vol. 27(7), pages 1-28, October.
    9. Haofan Mu & Weixiu Shi, 2024. "Review of Operation Performance and Application Status of Pulsating Heat Pipe," Sustainability, MDPI, vol. 16(7), pages 1-24, March.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:gam:jeners:v:16:y:2023:i:21:p:7228-:d:1266220. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    If CitEc recognized a bibliographic reference but did not link an item in RePEc to it, you can help with this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: MDPI Indexing Manager (email available below). General contact details of provider: https://www.mdpi.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.