IDEAS home Printed from https://ideas.repec.org/a/spr/joinma/v35y2024i1d10.1007_s10845-022-02040-w.html
   My bibliography  Save this article

Material removal rate prediction in chemical mechanical planarization with conditional probabilistic autoencoder and stacking ensemble learning

Author

Listed:
  • Yupeng Wei

    (San Jose State University)

  • Dazhong Wu

    (University of Central Florida)

Abstract

Chemical mechanical planarization (CMP) is a complex and high-accuracy polishing process that creates a smooth and planar material surface. One of the key challenges of CMP is to predict the material removal rate (MRR) accurately. With the development of artificial intelligence techniques, numerous data-driven models have been developed to predict the MRR in the CMP process. However, these methods are not capable of considering surface topography in MRR predictions because it is difficult to observe and measure the surface topography. To address this issue, we propose a graphical model and a conditional variational autoencoder to extract the features of surface topography in the CMP process. Moreover, process variables and the extracted features of surface topography are fed into an ensemble learning-based predictive model to predict the MRR. Experimental results have shown that the proposed method can predict the MRR accurately with a root mean squared error of 6.12 nm/min, and it outperforms physics-based machine learning and data-driven methods.

Suggested Citation

  • Yupeng Wei & Dazhong Wu, 2024. "Material removal rate prediction in chemical mechanical planarization with conditional probabilistic autoencoder and stacking ensemble learning," Journal of Intelligent Manufacturing, Springer, vol. 35(1), pages 115-127, January.
  • Handle: RePEc:spr:joinma:v:35:y:2024:i:1:d:10.1007_s10845-022-02040-w
    DOI: 10.1007/s10845-022-02040-w
    as

    Download full text from publisher

    File URL: http://link.springer.com/10.1007/s10845-022-02040-w
    File Function: Abstract
    Download Restriction: Access to the full text of the articles in this series is restricted.

    File URL: https://libkey.io/10.1007/s10845-022-02040-w?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    References listed on IDEAS

    as
    1. Dazhong Wu & Yupeng Wei & Janis Terpenny, 2019. "Predictive modelling of surface roughness in fused deposition modelling using data fusion," International Journal of Production Research, Taylor & Francis Journals, vol. 57(12), pages 3992-4006, June.
    2. Ki Bum Lee & Chang Ouk Kim, 2020. "Recurrent feature-incorporated convolutional neural network for virtual metrology of the chemical mechanical planarization process," Journal of Intelligent Manufacturing, Springer, vol. 31(1), pages 73-86, January.
    3. Edoardo M Airoldi, 2007. "Getting Started in Probabilistic Graphical Models," PLOS Computational Biology, Public Library of Science, vol. 3(12), pages 1-5, December.
    Full references (including those not matched with items on IDEAS)

    Most related items

    These are the items that most often cite the same works as this one and are cited by the same works as this one.
    1. Sangho Lee & Youngdoo Son, 2021. "Motor Load Balancing with Roll Force Prediction for a Cold-Rolling Setup with Neural Networks," Mathematics, MDPI, vol. 9(12), pages 1-21, June.
    2. David C Molik & DeAndre Tomlinson & Shane Davitt & Eric L Morgan & Matthew Sisk & Benjamin Roche & Natalie Meyers & Michael E Pfrender, 2021. "Combining natural language processing and metabarcoding to reveal pathogen-environment associations," PLOS Neglected Tropical Diseases, Public Library of Science, vol. 15(4), pages 1-21, April.
    3. Vishnu Baburajan & Jo~ao de Abreu e Silva & Francisco Camara Pereira, 2022. "Open vs Closed-ended questions in attitudinal surveys -- comparing, combining, and interpreting using natural language processing," Papers 2205.01317, arXiv.org.
    4. Jeongsub Choi & Mengmeng Zhu & Jihoon Kang & Myong K. Jeong, 2024. "Convolutional neural network based multi-input multi-output model for multi-sensor multivariate virtual metrology in semiconductor manufacturing," Annals of Operations Research, Springer, vol. 339(1), pages 185-201, August.
    5. Marić, Josip & Opazo-Basáez, Marco & Vlačić, Božidar & Dabić, Marina, 2023. "Innovation management of three-dimensional printing (3DP) technology: Disclosing insights from existing literature and determining future research streams," Technological Forecasting and Social Change, Elsevier, vol. 193(C).
    6. Youngju Kim & Hoyeop Lee & Chang Ouk Kim, 2023. "A variational autoencoder for a semiconductor fault detection model robust to process drift due to incomplete maintenance," Journal of Intelligent Manufacturing, Springer, vol. 34(2), pages 529-540, February.
    7. Liqiao Xia & Pai Zheng & Xiao Huang & Chao Liu, 2022. "A novel hypergraph convolution network-based approach for predicting the material removal rate in chemical mechanical planarization," Journal of Intelligent Manufacturing, Springer, vol. 33(8), pages 2295-2306, December.
    8. Ying Zhang & Mutahar Safdar & Jiarui Xie & Jinghao Li & Manuel Sage & Yaoyao Fiona Zhao, 2023. "A systematic review on data of additive manufacturing for machine learning applications: the data quality, type, preprocessing, and management," Journal of Intelligent Manufacturing, Springer, vol. 34(8), pages 3305-3340, December.
    9. Shanmugaraj Senthilnathan & Benny Raphael, 2022. "Using Computer Vision for Monitoring the Quality of 3D-Printed Concrete Structures," Sustainability, MDPI, vol. 14(23), pages 1-21, November.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:spr:joinma:v:35:y:2024:i:1:d:10.1007_s10845-022-02040-w. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    If CitEc recognized a bibliographic reference but did not link an item in RePEc to it, you can help with this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Sonal Shukla or Springer Nature Abstracting and Indexing (email available below). General contact details of provider: http://www.springer.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.