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Adaptative two-phase thermal circulation system for complex-shaped electronic device cooling

Author

Listed:
  • Wenjun Xu

    (Xiamen University)

  • Jiarong Cui

    (Xiamen University)

  • Yao Ma

    (Xiamen University)

  • Zhanpeng Hu

    (Xiamen University)

  • Yuyang Qi

    (Xiamen University)

  • Xinying Li

    (The Hong Kong Polytechnic University)

  • Yuchen Zhong

    (Xiamen University)

  • Tao Luo

    (Xiamen University)

  • Xuyang Chu

    (Xiamen University)

  • Linjing Wu

    (Xiamen University)

  • Weisong Ling

    (Xiamen University)

  • Wei Zhou

    (Xiamen University)

Abstract

Thermal management using a vapor-liquid two-phase circulation system is challenging in compact and complex-shaped electronic devices. In this study, we design and fabricate a heat pipe that can adapt to various shapes, regardless of space constraints. The heat pipe is capable of bending or twisting in three dimensions, making it suitable for electronic devices of arbitrary shapes. It effectively transfers heat from in-plane chips to out-of-plane spaces through flexible circulation pathways. This two-phase heat cycle system achieves an ultra-high thermal conductivity of up to 11,363 W/m·K. The flexible and adaptive design strategy enables efficient heat transfer in complex and compact environments.

Suggested Citation

  • Wenjun Xu & Jiarong Cui & Yao Ma & Zhanpeng Hu & Yuyang Qi & Xinying Li & Yuchen Zhong & Tao Luo & Xuyang Chu & Linjing Wu & Weisong Ling & Wei Zhou, 2025. "Adaptative two-phase thermal circulation system for complex-shaped electronic device cooling," Nature Communications, Nature, vol. 16(1), pages 1-15, December.
    • Handle: RePEc:nat:natcom:v:16:y:2025:i:1:d:10.1038_s41467-025-56960-1
    DOI: 10.1038/s41467-025-56960-1
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    References listed on IDEAS

    as
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