Author
Listed:
- Sahar Jaddi
(Materials and Civil Engineering)
- M. Wasil Malik
(Electronics and Applied Mathematics)
- Bin Wang
(Electronics and Applied Mathematics
Hunan University)
- Nicola M. Pugno
(University of Trento
Queen Mary University of London)
- Yun Zeng
(Hunan University)
- Michael Coulombier
(Materials and Civil Engineering)
- Jean-Pierre Raskin
(Electronics and Applied Mathematics)
- Thomas Pardoen
(Materials and Civil Engineering
WEL Research Institute)
Abstract
Fail-safe design of devices requires robust integrity assessment procedures which are still absent for 2D materials, hence affecting transfer to applications. Here, a combined on-chip tension and cracking method, and associated data reduction scheme have been developed to determine the fracture toughness and strength of monolayer-monodomain-freestanding graphene. Myriads of specimens are generated providing statistical data. The crack arrest tests provide a definitive fracture toughness of 4.4 MPa $$\sqrt{{{{{{\rm{m}}}}}}}$$ m . Tension on-chip provides Young’s modulus of 950 GPa, fracture strain of 11%, and tensile strength up to 110 GPa, reaching a record of stored elastic energy ~6 GJ m−3 as confirmed by thermodynamics and quantized fracture mechanics. A ~ 1.4 nm crack size is often found responsible for graphene failure, connected to 5-7 pair defects. Micron-sized graphene membranes and smaller can be produced defect-free, and design rules can be based on 110 GPa strength. For larger areas, a fail-safe design should be based on a maximum 57 GPa strength.
Suggested Citation
Sahar Jaddi & M. Wasil Malik & Bin Wang & Nicola M. Pugno & Yun Zeng & Michael Coulombier & Jean-Pierre Raskin & Thomas Pardoen, 2024.
"Definitive engineering strength and fracture toughness of graphene through on-chip nanomechanics,"
Nature Communications, Nature, vol. 15(1), pages 1-11, December.
Handle:
RePEc:nat:natcom:v:15:y:2024:i:1:d:10.1038_s41467-024-49426-3
DOI: 10.1038/s41467-024-49426-3
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