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Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

Author

Listed:
  • Ali Roshanghias

    (Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria)

  • Perla Malago

    (Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria)

  • Jaroslaw Kaczynski

    (Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria)

  • Timothy Polom

    (Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria)

  • Jochen Bardong

    (Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria)

  • Dominik Holzmann

    (Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria)

  • Muhammad-Hassan Malik

    (Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria)

  • Michael Ortner

    (Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria)

  • Christina Hirschl

    (Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria)

  • Alfred Binder

    (Silicon Austria Labs GmbH, Europastrasse 12, 9524 Villach, Austria)

Abstract

Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, copper sinter paste was exploited as a fully printed interconnect and, additionally, as a copper clip-attach. The electrical and thermal performances of the copper-sinter paste interconnections (“sinterconnects”) were compared to a system with wire bonds. The results indicate comparable characteristics of the sinterconnect structures to the wire-bonded ones. Moreover, the performance of copper sinterconnects in a power module was further quantified at higher load currents via finite element analysis. It was identified that the full-area thermal and electrical contact facilitated by the planar sinterconnects can reduce ohmic losses and enhance the thermal management of the power packages.

Suggested Citation

  • Ali Roshanghias & Perla Malago & Jaroslaw Kaczynski & Timothy Polom & Jochen Bardong & Dominik Holzmann & Muhammad-Hassan Malik & Michael Ortner & Christina Hirschl & Alfred Binder, 2021. "Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging," Energies, MDPI, vol. 14(8), pages 1-13, April.
    • Handle: RePEc:gam:jeners:v:14:y:2021:i:8:p:2176-:d:535560
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    References listed on IDEAS

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    1. Sayan Seal & Homer Alan Mantooth, 2017. "High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions," Energies, MDPI, vol. 10(3), pages 1-30, March.
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