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High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions

Author

Listed:
  • Sayan Seal

    (Department of Electrical Engineering, University of Arkansas, Fayetteville, AR 72701, USA)

  • Homer Alan Mantooth

    (Department of Electrical Engineering, University of Arkansas, Fayetteville, AR 72701, USA)

Abstract

This paper presents a vision for the future of 3D packaging and integration of silicon carbide (SiC) power modules. Several major achievements and novel architectures in SiC modules from the past and present have been highlighted. Having considered these advancements, the major technology barriers preventing SiC power devices from performing to their fullest ability were identified. 3D wire bondless approaches adopted for enhancing the performance of silicon power modules were surveyed, and their merits were assessed to serve as a vision for the future of SiC power packaging. Current efforts pursuing 3D wire bondless SiC power modules were described, and the concept for a novel SiC power module was discussed.

Suggested Citation

  • Sayan Seal & Homer Alan Mantooth, 2017. "High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions," Energies, MDPI, vol. 10(3), pages 1-30, March.
    • Handle: RePEc:gam:jeners:v:10:y:2017:i:3:p:341-:d:92746
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    Citations

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    Cited by:

    1. Omar Sarwar Chaudhary & Mouloud Denaï & Shady S. Refaat & Georgios Pissanidis, 2023. "Technology and Applications of Wide Bandgap Semiconductor Materials: Current State and Future Trends," Energies, MDPI, vol. 16(18), pages 1-27, September.
    2. Fernando Acosta-Cambranis & Jordi Zaragoza & Luis Romeral & Néstor Berbel, 2020. "Comparative Analysis of SVM Techniques for a Five-Phase VSI Based on SiC Devices," Energies, MDPI, vol. 13(24), pages 1-25, December.
    3. Andressa Nakahata-Medrado & Jean-Luc Schanen & Jean-Michel Guichon & Pierre-Olivier Jeannin & Emmanuel Batista & Guillaume Desportes, 2021. "Optimization of a Gate Distribution Layout to Compensate the Current Imbalance Generated by the 3D Geometry of a Railway Inverter," Energies, MDPI, vol. 14(7), pages 1-18, March.
    4. Matallana, A. & Ibarra, E. & López, I. & Andreu, J. & Garate, J.I. & Jordà, X. & Rebollo, J., 2019. "Power module electronics in HEV/EV applications: New trends in wide-bandgap semiconductor technologies and design aspects," Renewable and Sustainable Energy Reviews, Elsevier, vol. 113(C), pages 1-1.
    5. Ali Roshanghias & Perla Malago & Jaroslaw Kaczynski & Timothy Polom & Jochen Bardong & Dominik Holzmann & Muhammad-Hassan Malik & Michael Ortner & Christina Hirschl & Alfred Binder, 2021. "Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging," Energies, MDPI, vol. 14(8), pages 1-13, April.

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