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Optimization of a Gate Distribution Layout to Compensate the Current Imbalance Generated by the 3D Geometry of a Railway Inverter

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  • Andressa Nakahata-Medrado

    (G2ELab, University Grenoble Alpes, 21 Av des Martyrs, 38000 Grenoble, France
    Alstom Transport, 21 rue Dr Guinier, 65600 Semeac, France)

  • Jean-Luc Schanen

    (G2ELab, University Grenoble Alpes, 21 Av des Martyrs, 38000 Grenoble, France)

  • Jean-Michel Guichon

    (G2ELab, University Grenoble Alpes, 21 Av des Martyrs, 38000 Grenoble, France)

  • Pierre-Olivier Jeannin

    (G2ELab, University Grenoble Alpes, 21 Av des Martyrs, 38000 Grenoble, France)

  • Emmanuel Batista

    (Alstom Transport, 21 rue Dr Guinier, 65600 Semeac, France)

  • Guillaume Desportes

    (Alstom Transport, 21 rue Dr Guinier, 65600 Semeac, France)

Abstract

The impact of the stray inductances originated from interconnects in power electronics becomes crucial with the next generation of SiC devices. This paper shows that the existing layout of a railway inverter, operating with Si IGBTs already exhibits a dynamic current imbalance between paralleled modules. This will not allow using this geometry with SiC MOSFETs. A complete investigation of the electromagnetic origin of this issue has been performed. A generic circuit model has been proposed to establish a cabling rule to design a Gate Distribution Printed Circuit Board (PCB) in such a way that it compensates the power dissymmetry. An optimization strategy has been used to obtain a new geometry of this PCB, which has been validated with a time domain simulation.

Suggested Citation

  • Andressa Nakahata-Medrado & Jean-Luc Schanen & Jean-Michel Guichon & Pierre-Olivier Jeannin & Emmanuel Batista & Guillaume Desportes, 2021. "Optimization of a Gate Distribution Layout to Compensate the Current Imbalance Generated by the 3D Geometry of a Railway Inverter," Energies, MDPI, vol. 14(7), pages 1-18, March.
    • Handle: RePEc:gam:jeners:v:14:y:2021:i:7:p:1891-:d:526228
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    References listed on IDEAS

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    1. Sayan Seal & Homer Alan Mantooth, 2017. "High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions," Energies, MDPI, vol. 10(3), pages 1-30, March.
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