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Study on the Mechanism of Motion Interaction between Soil and a Bionic Hole-Forming Device

Author

Listed:
  • Long Wang

    (College of Mechanical and Electronic Engineering, Tarim University, Alar 843300, China
    College of Engineering, China Agricultural University, Beijing 100083, China)

  • Jianfei Xing

    (College of Mechanical and Electronic Engineering, Tarim University, Alar 843300, China)

  • Xiaowei He

    (College of Mechanical and Electronic Engineering, Tarim University, Alar 843300, China)

  • Xin Li

    (School of Mechanical Engineering, Hunan University of Technology, Zhuzhou 412007, China)

  • Wensong Guo

    (College of Mechanical and Electronic Engineering, Tarim University, Alar 843300, China)

  • Xufeng Wang

    (College of Mechanical and Electronic Engineering, Tarim University, Alar 843300, China)

  • Shulin Hou

    (College of Engineering, China Agricultural University, Beijing 100083, China)

Abstract

Due to the lack of water resources, the main agricultural planting method used in the northwest region of China is plastic film mulching, with precision hole sowing performed on the film after mulching. However, conventional hole-forming devices damage the compactness of the soil hole while moving on the plastic film, causing seed misplacement. Therefore, this study designed a bionic hole-forming device based on the oriental mole cricket. In order to explore the interaction between the hole-forming device and the soil, a typical soil discrete element particle model was established, and its contact parameters were calibrated. An experiment was conducted to compare the performance of the bionic hole-forming device with a conventional device using discrete element method and multi-body dynamics (DEM-MBD) coupled simulations. The results revealed that the bionic hole-forming device caused less soil disturbance during the hole-forming process and could reduce the sowing operation resistance compared to the traditional device. Compared to traditional square and cone-shaped hole-forming devices, the soil resistance of the bionic hole-forming device was the smallest, at 7.51 N. This work provides a reference for the optimization of hole-forming devices for plastic film sowing.

Suggested Citation

  • Long Wang & Jianfei Xing & Xiaowei He & Xin Li & Wensong Guo & Xufeng Wang & Shulin Hou, 2023. "Study on the Mechanism of Motion Interaction between Soil and a Bionic Hole-Forming Device," Agriculture, MDPI, vol. 13(7), pages 1-18, July.
    • Handle: RePEc:gam:jagris:v:13:y:2023:i:7:p:1421-:d:1196954
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    References listed on IDEAS

    as
    1. Mustafa Ucgul, 2023. "Simulating Soil–Disc Plough Interaction Using Discrete Element Method–Multi-Body Dynamic Coupling," Agriculture, MDPI, vol. 13(2), pages 1-14, January.
    2. Kojo Atta Aikins & Mustafa Ucgul & James B. Barr & Emmanuel Awuah & Diogenes L. Antille & Troy A. Jensen & Jacky M. A. Desbiolles, 2023. "Review of Discrete Element Method Simulations of Soil Tillage and Furrow Opening," Agriculture, MDPI, vol. 13(3), pages 1-29, February.
    3. Yiqing Qiu & Zhijun Guo & Xin Jin & Pangang Zhang & Shengjie Si & Fugui Guo, 2022. "Calibration and Verification Test of Cinnamon Soil Simulation Parameters Based on Discrete Element Method," Agriculture, MDPI, vol. 12(8), pages 1-17, July.
    4. Hongbo Zhao & Yuxiang Huang & Zhengdao Liu & Wenzheng Liu & Zhiqi Zheng, 2021. "Applications of Discrete Element Method in the Research of Agricultural Machinery: A Review," Agriculture, MDPI, vol. 11(5), pages 1-26, May.
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