Condition monitoring and prediction of solution quality during a copper electroplating process
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DOI: 10.1007/s10845-018-1445-4
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- A. Mosallam & K. Medjaher & N. Zerhouni, 2016. "Data-driven prognostic method based on Bayesian approaches for direct remaining useful life prediction," Journal of Intelligent Manufacturing, Springer, vol. 27(5), pages 1037-1048, October.
- Ahmed Ragab & Mohamed-Salah Ouali & Soumaya Yacout & Hany Osman, 2016. "Remaining useful life prediction using prognostic methodology based on logical analysis of data and Kaplan–Meier estimation," Journal of Intelligent Manufacturing, Springer, vol. 27(5), pages 943-958, October.
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Cited by:
- Jinping Liu & Jie Wang & Xianfeng Liu & Tianyu Ma & Zhaohui Tang, 2022. "MWRSPCA: online fault monitoring based on moving window recursive sparse principal component analysis," Journal of Intelligent Manufacturing, Springer, vol. 33(5), pages 1255-1271, June.
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Keywords
Condition monitoring; Fault prognostics; Prognostics and health management (PHM); Remaining useful life; Copper electroplating process;All these keywords.
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