IDEAS home Printed from https://ideas.repec.org/a/nat/natcom/v16y2025i1d10.1038_s41467-025-56163-8.html
   My bibliography  Save this article

Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling

Author

Listed:
  • Rui Cheng

    (5000 Forbes Ave)

  • Qixian Wang

    (5000 Forbes Ave)

  • Zexiao Wang

    (5000 Forbes Ave)

  • Lin Jing

    (5000 Forbes Ave)

  • Ana V. Garcia-Caraveo

    (1791 SW Campus Way)

  • Zhuo Li

    (5000 Forbes Ave)

  • Yibai Zhong

    (5000 Forbes Ave)

  • Xiu Liu

    (5000 Forbes Ave)

  • Xiao Luo

    (5000 Forbes Ave)

  • Tianyi Huang

    (5000 Forbes Ave)

  • Hyeong Seok Yun

    (5000 Forbes Ave)

  • Hakan Salihoglu

    (5000 Forbes Ave)

  • Loren Russell

    (201 N Braddock Ave STE 334)

  • Navid Kazem

    (201 N Braddock Ave STE 334)

  • Tianyi Chen

    (1791 SW Campus Way)

  • Sheng Shen

    (5000 Forbes Ave)

Abstract

Effective heat dissipation remains a grand challenge for energy-dense devices and systems. As heterogeneous integration becomes increasingly inevitable in electronics, thermal resistance at interfaces has emerged as a critical bottleneck for thermal management. However, existing thermal interface solutions are constrained by either high thermal resistance or poor reliability. We report a strategy to create printable, high-performance liquid-infused nanostructured composites, comprising a mechanically soft and thermally conductive double-sided Cu nanowire array scaffold infused with a customized thermal-bridge liquid that suppresses contact thermal resistance. The liquid infusion concept is versatile for a broad range of thermal interface applications. Remarkably, the liquid metal infused nanostructured composite exhibits an ultra-low thermal resistance

Suggested Citation

  • Rui Cheng & Qixian Wang & Zexiao Wang & Lin Jing & Ana V. Garcia-Caraveo & Zhuo Li & Yibai Zhong & Xiu Liu & Xiao Luo & Tianyi Huang & Hyeong Seok Yun & Hakan Salihoglu & Loren Russell & Navid Kazem &, 2025. "Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling," Nature Communications, Nature, vol. 16(1), pages 1-8, December.
    • Handle: RePEc:nat:natcom:v:16:y:2025:i:1:d:10.1038_s41467-025-56163-8
    DOI: 10.1038/s41467-025-56163-8
    as

    Download full text from publisher

    File URL: https://www.nature.com/articles/s41467-025-56163-8
    File Function: Abstract
    Download Restriction: no
    File URL: https://libkey.io/10.1038/s41467-025-56163-8?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    References listed on IDEAS

    as
    1. Keith T. Regner & Daniel P. Sellan & Zonghui Su & Cristina H. Amon & Alan J.H. McGaughey & Jonathan A. Malen, 2013. "Broadband phonon mean free path contributions to thermal conductivity measured using frequency domain thermoreflectance," Nature Communications, Nature, vol. 4(1), pages 1-7, June.
    2. Ying Cui & Zihao Qin & Huan Wu & Man Li & Yongjie Hu, 2021. "Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management," Nature Communications, Nature, vol. 12(1), pages 1-7, December.
    Full references (including those not matched with items on IDEAS)

    Most related items

    These are the items that most often cite the same works as this one and are cited by the same works as this one.
    1. R. Meyer & Graham W. Gibson & Alexander N. Robillard, 2024. "Effects of ballistic transport on the thermal resistance and temperature profile in nanowires," The European Physical Journal B: Condensed Matter and Complex Systems, Springer;EDP Sciences, vol. 97(6), pages 1-13, June.
    2. Kang Won Lee & Jonghun Yi & Min Ku Kim & Dong Rip Kim, 2024. "Transparent radiative cooling cover window for flexible and foldable electronic displays," Nature Communications, Nature, vol. 15(1), pages 1-11, December.
    3. Jing Wu & E Zhou & An Huang & Hongbin Zhang & Ming Hu & Guangzhao Qin, 2024. "Deep-potential enabled multiscale simulation of gallium nitride devices on boron arsenide cooling substrates," Nature Communications, Nature, vol. 15(1), pages 1-9, December.
    4. Chen, Gong & Yan, Caiman & Yin, Shubin & Tang, Yong & Yuan, Wei & Zhang, Shiwei, 2024. "Vapor-liquid coplanar structure enables high thermal conductive and extremely ultrathin vapor chamber," Energy, Elsevier, vol. 301(C).
    5. Tang, Heng & Xia, Liangfeng & Tang, Yong & Weng, Changxing & Hu, Zuohuan & Wu, Xiaoyu & Sun, Yalong, 2022. "Fabrication and pool boiling performance assessment of microgroove array surfaces with secondary micro-structures for high power applications," Renewable Energy, Elsevier, vol. 187(C), pages 790-800.
    6. Yu Pei & Li Chen & Wonjae Jeon & Zhaowei Liu & Renkun Chen, 2023. "Low-dimensional heat conduction in surface phonon polariton waveguide," Nature Communications, Nature, vol. 14(1), pages 1-8, December.

    More about this item

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:nat:natcom:v:16:y:2025:i:1:d:10.1038_s41467-025-56163-8. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    If CitEc recognized a bibliographic reference but did not link an item in RePEc to it, you can help with this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Sonal Shukla or Springer Nature Abstracting and Indexing (email available below). General contact details of provider: http://www.nature.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.