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Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

Author

Listed:
  • Ying Cui

    (University of California, Los Angeles (UCLA))

  • Zihao Qin

    (University of California, Los Angeles (UCLA))

  • Huan Wu

    (University of California, Los Angeles (UCLA))

  • Man Li

    (University of California, Los Angeles (UCLA))

  • Yongjie Hu

    (University of California, Los Angeles (UCLA))

Abstract

Thermal management is the most critical technology challenge for modern electronics. Recent key materials innovation focuses on developing advanced thermal interface of electronic packaging for achieving efficient heat dissipation. Here, for the first time we report a record-high performance thermal interface beyond the current state of the art, based on self-assembled manufacturing of cubic boron arsenide (s-BAs). The s-BAs exhibits highly desirable characteristics of high thermal conductivity up to 21 W/m·K and excellent elastic compliance similar to that of soft biological tissues down to 100 kPa through the rational design of BAs microcrystals in polymer composite. In addition, the s-BAs demonstrates high flexibility and preserves the high conductivity over at least 500 bending cycles, opening up new application opportunities for flexible thermal cooling. Moreover, we demonstrated device integration with power LEDs and measured a superior cooling performance of s-BAs beyond the current state of the art, by up to 45 °C reduction in the hot spot temperature. Together, this study demonstrates scalable manufacturing of a new generation of energy-efficient and flexible thermal interface that holds great promise for advanced thermal management of future integrated circuits and emerging applications such as wearable electronics and soft robotics.

Suggested Citation

  • Ying Cui & Zihao Qin & Huan Wu & Man Li & Yongjie Hu, 2021. "Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management," Nature Communications, Nature, vol. 12(1), pages 1-7, December.
  • Handle: RePEc:nat:natcom:v:12:y:2021:i:1:d:10.1038_s41467-021-21531-7
    DOI: 10.1038/s41467-021-21531-7
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    Cited by:

    1. Kang Won Lee & Jonghun Yi & Min Ku Kim & Dong Rip Kim, 2024. "Transparent radiative cooling cover window for flexible and foldable electronic displays," Nature Communications, Nature, vol. 15(1), pages 1-11, December.
    2. Tang, Heng & Xia, Liangfeng & Tang, Yong & Weng, Changxing & Hu, Zuohuan & Wu, Xiaoyu & Sun, Yalong, 2022. "Fabrication and pool boiling performance assessment of microgroove array surfaces with secondary micro-structures for high power applications," Renewable Energy, Elsevier, vol. 187(C), pages 790-800.
    3. Jing Wu & E Zhou & An Huang & Hongbin Zhang & Ming Hu & Guangzhao Qin, 2024. "Deep-potential enabled multiscale simulation of gallium nitride devices on boron arsenide cooling substrates," Nature Communications, Nature, vol. 15(1), pages 1-9, December.
    4. Chen, Gong & Yan, Caiman & Yin, Shubin & Tang, Yong & Yuan, Wei & Zhang, Shiwei, 2024. "Vapor-liquid coplanar structure enables high thermal conductive and extremely ultrathin vapor chamber," Energy, Elsevier, vol. 301(C).

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