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A universal packaging substrate for mechanically stable assembly of stretchable electronics

Author

Listed:
  • Yan Shao

    (Southern University of Science and Technology
    Yancheng Institute of Technology)

  • Jianfeng Yan

    (Southern University of Science and Technology)

  • Yinglin Zhi

    (Southern University of Science and Technology)

  • Chun Li

    (Southern University of Science and Technology)

  • Qingxian Li

    (Southern University of Science and Technology)

  • Kaimin Wang

    (Southern University of Science and Technology)

  • Rui Xia

    (Southern University of Science and Technology)

  • Xinyue Xiang

    (Southern University of Science and Technology)

  • Liqian Liu

    (Southern University of Science and Technology)

  • Guoli Chen

    (Southern University of Science and Technology)

  • Hanxue Zhang

    (Southern University of Science and Technology)

  • Daohang Cai

    (Southern University of Science and Technology)

  • Haochuan Wang

    (Southern University of Science and Technology)

  • Xing Cheng

    (Southern University of Science and Technology)

  • Canhui Yang

    (Southern University of Science and Technology)

  • Fuzeng Ren

    (Southern University of Science and Technology)

  • Yanhao Yu

    (Southern University of Science and Technology
    Southern University of Science and Technology)

Abstract

Stretchable electronics commonly assemble multiple material modules with varied bulk moduli and surface chemistry on one packaging substrate. Preventing the strain-induced delamination between the module and the substrate has been a critical challenge. Here we develop a packaging substrate that delivers mechanically stable module/substrate interfaces for a broad range of stiff and stretchable modules with varied surface chemistries. The key design of the substrate was to introduce module-specific stretchability and universal adhesiveness by regionally tuning the bulk molecular mobility and surface molecular polarity of a near-hermetic elastic polymer matrix. The packaging substrate can customize the deformation of different modules while avoiding delamination upon stretching up to 600%. Based on this substrate, we fabricated a fully stretchable bioelectronic device that can serve as a respiration sensor or an electric generator with an in vivo lifetime of 10 weeks. This substrate could be a versatile platform for device assembly.

Suggested Citation

  • Yan Shao & Jianfeng Yan & Yinglin Zhi & Chun Li & Qingxian Li & Kaimin Wang & Rui Xia & Xinyue Xiang & Liqian Liu & Guoli Chen & Hanxue Zhang & Daohang Cai & Haochuan Wang & Xing Cheng & Canhui Yang &, 2024. "A universal packaging substrate for mechanically stable assembly of stretchable electronics," Nature Communications, Nature, vol. 15(1), pages 1-11, December.
    • Handle: RePEc:nat:natcom:v:15:y:2024:i:1:d:10.1038_s41467-024-50494-8
    DOI: 10.1038/s41467-024-50494-8
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    References listed on IDEAS

    as
    1. Yang Li & Nan Li & Wei Liu & Aleksander Prominski & Seounghun Kang & Yahao Dai & Youdi Liu & Huawei Hu & Shinya Wai & Shilei Dai & Zhe Cheng & Qi Su & Ping Cheng & Chen Wei & Lihua Jin & Jeffrey A. Hu, 2023. "Achieving tissue-level softness on stretchable electronics through a generalizable soft interlayer design," Nature Communications, Nature, vol. 14(1), pages 1-10, December.
    2. Rafael Libanori & Randall M. Erb & Alain Reiser & Hortense Le Ferrand & Martin J. Süess & Ralph Spolenak & André R. Studart, 2012. "Stretchable heterogeneous composites with extreme mechanical gradients," Nature Communications, Nature, vol. 3(1), pages 1-9, January.
    3. Ying Jiang & Shaobo Ji & Jing Sun & Jianping Huang & Yuanheng Li & Guijin Zou & Teddy Salim & Changxian Wang & Wenlong Li & Haoran Jin & Jie Xu & Sihong Wang & Ting Lei & Xuzhou Yan & Wendy Yen Xian P, 2023. "A universal interface for plug-and-play assembly of stretchable devices," Nature, Nature, vol. 614(7948), pages 456-462, February.
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