IDEAS home Printed from https://ideas.repec.org/a/nat/natcom/v15y2024i1d10.1038_s41467-024-50494-8.html
   My bibliography  Save this article

A universal packaging substrate for mechanically stable assembly of stretchable electronics

Author

Listed:
  • Yan Shao

    (Southern University of Science and Technology
    Yancheng Institute of Technology)

  • Jianfeng Yan

    (Southern University of Science and Technology)

  • Yinglin Zhi

    (Southern University of Science and Technology)

  • Chun Li

    (Southern University of Science and Technology)

  • Qingxian Li

    (Southern University of Science and Technology)

  • Kaimin Wang

    (Southern University of Science and Technology)

  • Rui Xia

    (Southern University of Science and Technology)

  • Xinyue Xiang

    (Southern University of Science and Technology)

  • Liqian Liu

    (Southern University of Science and Technology)

  • Guoli Chen

    (Southern University of Science and Technology)

  • Hanxue Zhang

    (Southern University of Science and Technology)

  • Daohang Cai

    (Southern University of Science and Technology)

  • Haochuan Wang

    (Southern University of Science and Technology)

  • Xing Cheng

    (Southern University of Science and Technology)

  • Canhui Yang

    (Southern University of Science and Technology)

  • Fuzeng Ren

    (Southern University of Science and Technology)

  • Yanhao Yu

    (Southern University of Science and Technology
    Southern University of Science and Technology)

Abstract

Stretchable electronics commonly assemble multiple material modules with varied bulk moduli and surface chemistry on one packaging substrate. Preventing the strain-induced delamination between the module and the substrate has been a critical challenge. Here we develop a packaging substrate that delivers mechanically stable module/substrate interfaces for a broad range of stiff and stretchable modules with varied surface chemistries. The key design of the substrate was to introduce module-specific stretchability and universal adhesiveness by regionally tuning the bulk molecular mobility and surface molecular polarity of a near-hermetic elastic polymer matrix. The packaging substrate can customize the deformation of different modules while avoiding delamination upon stretching up to 600%. Based on this substrate, we fabricated a fully stretchable bioelectronic device that can serve as a respiration sensor or an electric generator with an in vivo lifetime of 10 weeks. This substrate could be a versatile platform for device assembly.

Suggested Citation

  • Yan Shao & Jianfeng Yan & Yinglin Zhi & Chun Li & Qingxian Li & Kaimin Wang & Rui Xia & Xinyue Xiang & Liqian Liu & Guoli Chen & Hanxue Zhang & Daohang Cai & Haochuan Wang & Xing Cheng & Canhui Yang &, 2024. "A universal packaging substrate for mechanically stable assembly of stretchable electronics," Nature Communications, Nature, vol. 15(1), pages 1-11, December.
    • Handle: RePEc:nat:natcom:v:15:y:2024:i:1:d:10.1038_s41467-024-50494-8
    DOI: 10.1038/s41467-024-50494-8
    as

    Download full text from publisher

    File URL: https://www.nature.com/articles/s41467-024-50494-8
    File Function: Abstract
    Download Restriction: no
    File URL: https://libkey.io/10.1038/s41467-024-50494-8?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    References listed on IDEAS

    as
    1. Rafael Libanori & Randall M. Erb & Alain Reiser & Hortense Le Ferrand & Martin J. Süess & Ralph Spolenak & André R. Studart, 2012. "Stretchable heterogeneous composites with extreme mechanical gradients," Nature Communications, Nature, vol. 3(1), pages 1-9, January.
    2. Yang Li & Nan Li & Wei Liu & Aleksander Prominski & Seounghun Kang & Yahao Dai & Youdi Liu & Huawei Hu & Shinya Wai & Shilei Dai & Zhe Cheng & Qi Su & Ping Cheng & Chen Wei & Lihua Jin & Jeffrey A. Hu, 2023. "Achieving tissue-level softness on stretchable electronics through a generalizable soft interlayer design," Nature Communications, Nature, vol. 14(1), pages 1-10, December.
    3. Ying Jiang & Shaobo Ji & Jing Sun & Jianping Huang & Yuanheng Li & Guijin Zou & Teddy Salim & Changxian Wang & Wenlong Li & Haoran Jin & Jie Xu & Sihong Wang & Ting Lei & Xuzhou Yan & Wendy Yen Xian P, 2023. "A universal interface for plug-and-play assembly of stretchable devices," Nature, Nature, vol. 614(7948), pages 456-462, February.
    Full references (including those not matched with items on IDEAS)

    Most related items

    These are the items that most often cite the same works as this one and are cited by the same works as this one.
    1. Soosang Chae & Won Jin Choi & Lisa Julia Nebel & Chang Hee Cho & Quinn A. Besford & André Knapp & Pavlo Makushko & Yevhen Zabila & Oleksandr Pylypovskyi & Min Woo Jeong & Stanislav Avdoshenko & Oliver, 2024. "Kinetically controlled metal-elastomer nanophases for environmentally resilient stretchable electronics," Nature Communications, Nature, vol. 15(1), pages 1-12, December.
    2. Yangshuang Bian & Mingliang Zhu & Chengyu Wang & Kai Liu & Wenkang Shi & Zhiheng Zhu & Mingcong Qin & Fan Zhang & Zhiyuan Zhao & Hanlin Wang & Yunqi Liu & Yunlong Guo, 2024. "A detachable interface for stable low-voltage stretchable transistor arrays and high-resolution X-ray imaging," Nature Communications, Nature, vol. 15(1), pages 1-9, December.
    3. Liqing Ai & Weikang Lin & Chunyan Cao & Pengyu Li & Xuejiao Wang & Dong Lv & Xin Li & Zhengbao Yang & Xi Yao, 2023. "Tough soldering for stretchable electronics by small-molecule modulated interfacial assemblies," Nature Communications, Nature, vol. 14(1), pages 1-10, December.
    4. Jie Cao & Xusheng Liu & Jie Qiu & Zhifei Yue & Yang Li & Qian Xu & Yan Chen & Jiewen Chen & Hongfei Cheng & Guozhong Xing & Enming Song & Ming Wang & Qi Liu & Ming Liu, 2024. "Anti-friction gold-based stretchable electronics enabled by interfacial diffusion-induced cohesion," Nature Communications, Nature, vol. 15(1), pages 1-11, December.
    5. Shuangshuang Wan & Kepeng Wang & Peihong Huang & Xian Guo & Wurui Liu & Yaocheng Li & Jingjing Zhang & Zhiyang Li & Jiacheng Song & Wenjing Yang & Xianzheng Zhang & Xianguang Ding & David Tai Leong & , 2024. "Mechanoelectronic stimulation of autologous extracellular vesicle biosynthesis implant for gut microbiota modulation," Nature Communications, Nature, vol. 15(1), pages 1-14, December.
    6. Huating Ye & Baohu Wu & Shengtong Sun & Peiyi Wu, 2024. "Self-compliant ionic skin by leveraging hierarchical hydrogen bond association," Nature Communications, Nature, vol. 15(1), pages 1-12, December.
    7. Falon C. Kalutantirige & Jinlong He & Lehan Yao & Stephen Cotty & Shan Zhou & John W. Smith & Emad Tajkhorshid & Charles M. Schroeder & Jeffrey S. Moore & Hyosung An & Xiao Su & Ying Li & Qian Chen, 2024. "Beyond nothingness in the formation and functional relevance of voids in polymer films," Nature Communications, Nature, vol. 15(1), pages 1-16, December.
    8. Sujin Jeong & Hyungsoo Yoon & Lukas Felix Michalek & Geonhee Kim & Jinhyoung Kim & Jiseok Seo & Dahyun Kim & Hwaeun Park & Byeongmoon Lee & Yongtaek Hong, 2024. "Printable, stretchable metal-vapor-desorption layers for high-fidelity patterning in soft, freeform electronics," Nature Communications, Nature, vol. 15(1), pages 1-13, December.
    9. Zhiqiang Zhuo & Mingjian Ni & Ningning Yu & Yingying Zheng & Yingru Lin & Jing Yang & Lili Sun & Lizhi Wang & Lubing Bai & Wenyu Chen & Man Xu & Fengwei Huo & Jinyi Lin & Quanyou Feng & Wei Huang, 2024. "Intrinsically stretchable fully π-conjugated polymer film via fluid conjugated molecular external-plasticizing for flexible light-emitting diodes," Nature Communications, Nature, vol. 15(1), pages 1-10, December.

    More about this item

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:nat:natcom:v:15:y:2024:i:1:d:10.1038_s41467-024-50494-8. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    If CitEc recognized a bibliographic reference but did not link an item in RePEc to it, you can help with this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Sonal Shukla or Springer Nature Abstracting and Indexing (email available below). General contact details of provider: http://www.nature.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.