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Methods of Measurement of Die Temperature of Semiconductor Elements: A Review

Author

Listed:
  • Krzysztof Dziarski

    (Institute of Electric Power Engineering, Poznan University of Technology, Piotrowo Street 3A, 60-965 Poznan, Poland)

  • Arkadiusz Hulewicz

    (Institute of Electrical Engineering and Electronics, Poznan University of Technology, Piotrowo Street 3A, 60-965 Poznan, Poland)

  • Piotr Kuwałek

    (Institute of Electrical Engineering and Electronics, Poznan University of Technology, Piotrowo Street 3A, 60-965 Poznan, Poland)

  • Grzegorz Wiczyński

    (Institute of Electrical Engineering and Electronics, Poznan University of Technology, Piotrowo Street 3A, 60-965 Poznan, Poland)

Abstract

Monitoring the temperature of a semiconductor component allows for the prediction of potential failures, optimization of the selected cooling system, and extension of the useful life of the semiconductor component. There are many methods of measuring the crystal temperature of the semiconductor element referred to as a die. The resolution and accuracy of the measurements depend on the chosen method. This paper describes known methods for measuring and imaging the temperature distribution on the die surface of a semiconductor device. Relationships are also described that allow one to determine the die temperature on the basis of the case temperature. Current trends and directions of development for die temperature measurement methods are indicated.

Suggested Citation

  • Krzysztof Dziarski & Arkadiusz Hulewicz & Piotr Kuwałek & Grzegorz Wiczyński, 2023. "Methods of Measurement of Die Temperature of Semiconductor Elements: A Review," Energies, MDPI, vol. 16(6), pages 1-25, March.
    • Handle: RePEc:gam:jeners:v:16:y:2023:i:6:p:2559-:d:1091496
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    References listed on IDEAS

    as
    1. Krzysztof Górecki & Krzysztof Posobkiewicz, 2022. "Cooling Systems of Power Semiconductor Devices—A Review," Energies, MDPI, vol. 15(13), pages 1-29, June.
    2. András Poppe & Gábor Farkas & Lajos Gaál & Gusztáv Hantos & János Hegedüs & Márta Rencz, 2019. "Multi-Domain Modelling of LEDs for Supporting Virtual Prototyping of Luminaires," Energies, MDPI, vol. 12(10), pages 1-32, May.
    3. Charukeshi Joglekar & Benedict Mortimer & Ferdinanda Ponci & Antonello Monti & Rik W. De Doncker, 2022. "SST-Based Grid Reinforcement for Electromobility Integration in Distribution Grids," Energies, MDPI, vol. 15(9), pages 1-17, April.
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