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Compact Thermal Modeling of Modules Containing Multiple Power LEDs

Author

Listed:
  • Marcin Janicki

    (Department of Microelectronics and Computer Science, Lodz University of Technology, 90-924 Łódź, Poland)

  • Przemysław Ptak

    (Department of Marine Electronics, Gdynia Maritime University, 81-255 Gdynia, Poland)

  • Tomasz Torzewicz

    (Department of Microelectronics and Computer Science, Lodz University of Technology, 90-924 Łódź, Poland)

  • Krzysztof Górecki

    (Department of Marine Electronics, Gdynia Maritime University, 81-255 Gdynia, Poland)

Abstract

Temperature is an essential factor affecting the operation of light-emitting diodes (LEDs), which are often used in circuits containing multiple devices influencing each other. Therefore, the thermal models of such circuits should take into account not only the self-heating effects, but also the mutual thermal influences among devices. This problem is illustrated here based on the example of a module containing six LEDs forming on the substrate a hexagon. This module is supposed to operate without any heat sink in the natural convection cooling conditions, hence it has been proposed to increase the thermal pad area in order to lower the device-operating temperature. In the experimental part of the paper, the recorded diode-heating curves are processed using the network identification by deconvolution method. This allows for the computation of the thermal time constant spectra and the generation of device-compact thermal models. Moreover, the influence of the thermal pad surface area on the device temperature and the thermal coupling between LEDs is investigated.

Suggested Citation

  • Marcin Janicki & Przemysław Ptak & Tomasz Torzewicz & Krzysztof Górecki, 2020. "Compact Thermal Modeling of Modules Containing Multiple Power LEDs," Energies, MDPI, vol. 13(12), pages 1-9, June.
  • Handle: RePEc:gam:jeners:v:13:y:2020:i:12:p:3130-:d:372498
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    References listed on IDEAS

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    1. Anton Alexeev & Grigory Onushkin & Jean-Paul Linnartz & Genevieve Martin, 2019. "Multiple Heat Source Thermal Modeling and Transient Analysis of LEDs," Energies, MDPI, vol. 12(10), pages 1-28, May.
    2. Marcin Janicki & Tomasz Torzewicz & Przemysław Ptak & Tomasz Raszkowski & Agnieszka Samson & Krzysztof Górecki, 2019. "Parametric Compact Thermal Models of Power LEDs," Energies, MDPI, vol. 12(9), pages 1-10, May.
    3. András Poppe & Gábor Farkas & Lajos Gaál & Gusztáv Hantos & János Hegedüs & Márta Rencz, 2019. "Multi-Domain Modelling of LEDs for Supporting Virtual Prototyping of Luminaires," Energies, MDPI, vol. 12(10), pages 1-32, May.
    4. Genevieve Martin & Christophe Marty & Robin Bornoff & Andras Poppe & Grigory Onushkin & Marta Rencz & Joan Yu, 2019. "Luminaire Digital Design Flow with Multi-Domain Digital Twins of LEDs," Energies, MDPI, vol. 12(12), pages 1-28, June.
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    Cited by:

    1. Marcin Janicki & Przemysław Ptak & Tomasz Torzewicz & Krzysztof Górecki, 2023. "Experimental Determination of Thermal Couplings in Packages Containing Multiple LEDs," Energies, MDPI, vol. 16(4), pages 1-8, February.
    2. Krzysztof Górecki & Krzysztof Posobkiewicz, 2022. "Cooling Systems of Power Semiconductor Devices—A Review," Energies, MDPI, vol. 15(13), pages 1-29, June.

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