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Indirect Thermographic Temperature Measurement of a Power-Rectifying Diode Die Based on a Heat Sink Thermogram

Author

Listed:
  • Krzysztof Dziarski

    (Institute of Electric Power Engineering, Poznan University of Technology, Piotrowo 3A, 60-965 Poznan, Poland)

  • Arkadiusz Hulewicz

    (Institute of Electrical Engineering and Electronics, Poznan University of Technology, Piotrowo 3A, 60-965 Poznan, Poland)

  • Łukasz Drużyński

    (Institute of Electric Power Engineering, Poznan University of Technology, Piotrowo 3A, 60-965 Poznan, Poland)

  • Grzegorz Dombek

    (Institute of Electric Power Engineering, Poznan University of Technology, Piotrowo 3A, 60-965 Poznan, Poland)

Abstract

This article concerns the indirect thermographic measurement of the junction temperature of a D00-250-10 semiconductor diode. Herein, we show how the temperature of the semiconductor junction was estimated on the basis of the heat sink temperature. We discuss the methodology of selecting the points for thermographic measurement of the heat sink temperature and the diode case. The method of thermographic measurement of the heat sink temperature and the used measurement system are described. The simulation method used to obtain the temperature of the semiconductor diode junction on the basis of the thermographic measurement of the heat sink temperature, as well as the method of determining the emissivity and convection coefficients, is presented. In order to facilitate the understanding of the discussed issues, the construction of the diode and heat sink used, the heat flow equation and the finite element method are described. As a result of the work carried out, the point where the diode casing temperature is closest to the junction temperature was indicated, as well as which fragments of the heat sink should be observed in order to correctly estimate the temperature of the semiconductor junction. The indirect measurement of the semiconductor junction temperature was carried out for different values of the power dissipated in the junction.

Suggested Citation

  • Krzysztof Dziarski & Arkadiusz Hulewicz & Łukasz Drużyński & Grzegorz Dombek, 2022. "Indirect Thermographic Temperature Measurement of a Power-Rectifying Diode Die Based on a Heat Sink Thermogram," Energies, MDPI, vol. 16(1), pages 1-25, December.
    • Handle: RePEc:gam:jeners:v:16:y:2022:i:1:p:332-:d:1017644
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    References listed on IDEAS

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    1. Gilbert, Christopher L., 2022. "Warehouse load-out queues and aluminum prices," Journal of Commodity Markets, Elsevier, vol. 28(C).
    2. Krzysztof Dziarski & Arkadiusz Hulewicz & Grzegorz Dombek, 2021. "Thermographic Measurement of the Temperature of Reactive Power Compensation Capacitors," Energies, MDPI, vol. 14(18), pages 1-16, September.
    3. Christos A. Christodoulou & Vasiliki Vita & Valeri Mladenov & Lambros Ekonomou, 2018. "On the Computation of the Voltage Distribution along the Non-Linear Resistor of Gapless Metal Oxide Surge Arresters," Energies, MDPI, vol. 11(11), pages 1-14, November.
    4. Safaei, Mohammad Reza & Karimipour, Arash & Abdollahi, Ali & Nguyen, Truong Khang, 2018. "The investigation of thermal radiation and free convection heat transfer mechanisms of nanofluid inside a shallow cavity by lattice Boltzmann method," Physica A: Statistical Mechanics and its Applications, Elsevier, vol. 509(C), pages 515-535.
    5. Krzysztof Dziarski & Arkadiusz Hulewicz & Grzegorz Dombek & Łukasz Drużyński, 2022. "Indirect Thermographic Temperature Measurement of a Power-Rectifying Diode Die," Energies, MDPI, vol. 15(9), pages 1-17, April.
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