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Passive Cooling Analysis of an Electronic Chipset Using Nanoparticles and Metal-Foam Composite PCM: An Experimental Study

Author

Listed:
  • Faisal Hassan

    (Mechanical Engineering Department, University of Engineering and Technology, Taxila 47050, Pakistan)

  • Abid Hussain

    (Mechanical Engineering Department, University of Engineering and Technology, Taxila 47050, Pakistan)

  • Furqan Jamil

    (School of Engineering, Edith Cowan University, 270 Joondalup Drive, Joondalup, Perth, WA 6027, Australia)

  • Adeel Arshad

    (Department of Mechanical and Construction Engineering, Faculty of Engineering and Environment, Northumbria University, Newcastle upon Tyne NE1 8ST, UK)

  • Hafiz Muhammad Ali

    (Mechanical Engineering Department, King Fahd University of Petroleum & Minerals, Dhahran 31261, Saudi Arabia
    Interdisciplinary Research Center for Renewable Energy and Power Systems (IRC-REPS), King Fahd University of Petroleum and Minerals, Dhahran 31261, Saudi Arabia)

Abstract

Thermal management of electronic components is critical for long-term reliability and continuous operation, as the over-heating of electronic equipment leads to decrement in performance. The novelty of the current experimental study is to investigate the passive cooling of electronic equipment, by using nano-enriched phase change material (NEPCM) with copper foam having porosity of 97 % . The phase change material of PT-58 was used with graphene nanoplatelets (GNPs) and magnesium oxide (MgO) nanoparticles (NPs), having concentrations of 0.01 wt.% and 0.02 wt.%. Three power levels of 8 W, 16 W, and 24 W, with corresponding heating inputs of 0.77 kW/ m 2 , 1.54 kW/ m 2 and 2.3 kW/ m 2 , respectively, were used to simulate the heating input to heat sink for thermal characterization. According to results, at 0.77 kW/ m 2 heating input the maximum base temperature declined by 13.03% in 0.02 wt.% GNPs-NEPCM/copper foam case. At heating input of 1.54 kW/ m 2 , the maximum base temperature reduction of 16% was observed in case of 0.02 wt.% GNPs-NEPCM/copper foam and 13.1% in case of 0.02 wt.% MgO-NEPCM/copper foam. Similarly, at heating input of 2.3 kW/ m 2 , the maximum temperature of base lessened by 12.58% in case of 0.02 wt.% GNPs-NEPCM/copper foam. The highest time to reach the set point temperature of 50 ° C, 60 ° C, and 70 ° C was in case of GNPs-NEPCM/copper foam composites, while at all power levels MgO-NEPCM/copper foam gave comparable performance to GNPs based composite. Similar trend was observed in the study of enhancement ratio in operation time. From the results, it is concluded that the copper foam incorporation in NEPCM is an effective measure to mitigate the heat sink base temperature and can provide best cooling efficiency at low and higher heating loads.

Suggested Citation

  • Faisal Hassan & Abid Hussain & Furqan Jamil & Adeel Arshad & Hafiz Muhammad Ali, 2022. "Passive Cooling Analysis of an Electronic Chipset Using Nanoparticles and Metal-Foam Composite PCM: An Experimental Study," Energies, MDPI, vol. 15(22), pages 1-27, November.
    • Handle: RePEc:gam:jeners:v:15:y:2022:i:22:p:8746-:d:979147
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    References listed on IDEAS

    as
    1. Li, Wenqiang & Zhang, Duo & Jing, Tingting & Gao, Mingyu & Liu, Peijin & He, Guoqiang & Qin, Fei, 2018. "Nano-encapsulated phase change material slurry (Nano-PCMS) saturated in metal foam: A new stable and efficient strategy for passive thermal management," Energy, Elsevier, vol. 165(PA), pages 743-751.
    2. Jamil, Furqan & Ali, Hafiz Muhammad & Nasir, Muhammad Ali & Karahan, Mehmet & Janjua, M.M. & Naseer, Ammar & Ejaz, Ali & Pasha, Riffat Asim, 2021. "Evaluation of photovoltaic panels using different nano phase change material and a concise comparison: An experimental study," Renewable Energy, Elsevier, vol. 169(C), pages 1265-1279.
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    1. Martin Beer & Dušan Kudelas & Radim Rybár, 2022. "A Numerical Analysis of the Thermal Energy Storage Based on Porous Gyroid Structure Filled with Sodium Acetate Trihydrate," Energies, MDPI, vol. 16(1), pages 1-17, December.

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