Innovation Characteristics, Industrial Clusters, And Intra-Industry Spillover Effects In Integrated Circuit Industry
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DOI: 10.1142/S021987701350020X
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Cited by:- Li, Hongkuan & He, Haiyan & Shan, Jiefei & Cai, Jingjing, 2019. "Innovation efficiency of semiconductor industry in China: A new framework based on generalized three-stage DEA analysis," Socio-Economic Planning Sciences, Elsevier, vol. 66(C), pages 136-148.
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Keywords
Innovation; patent; spillover; panel data; Hausman test;
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