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Monitoring wafers’ geometric quality using an additive Gaussian process model

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  • Linmiao Zhang
  • Kaibo Wang
  • Nan Chen

Abstract

The geometric quality of a wafer is an important quality characteristic in the semiconductor industry. However, it is difficult to monitor this characteristic during the manufacturing process due to the challenges created by the complexity of the data structure. In this article, we propose an Additive Gaussian Process (AGP) model to approximate a standard geometric profile of a wafer while quantifying the deviations from the standard when a manufacturing process is in an in-control state. Based on the AGP model, two statistical tests are developed to determine whether or not a newly produced wafer is conforming. We have conducted extensive numerical simulations and real case studies, the results of which indicate that our proposed method is effective and has potentially wide application.

Suggested Citation

  • Linmiao Zhang & Kaibo Wang & Nan Chen, 2016. "Monitoring wafers’ geometric quality using an additive Gaussian process model," IISE Transactions, Taylor & Francis Journals, vol. 48(1), pages 1-15, January.
    • Handle: RePEc:taf:uiiexx:v:48:y:2016:i:1:p:1-15
    DOI: 10.1080/0740817X.2015.1027455
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    Cited by:

    1. Jaeseung Baek & Myong K. Jeong & Elsayed A. Elsayed, 2024. "Spatial randomness-based anomaly detection approach for monitoring local variations in multimode surface topography," Annals of Operations Research, Springer, vol. 341(1), pages 173-195, October.
    2. Chen Zhao & Shichang Du & Jun Lv & Yafei Deng & Guilong Li, 2023. "A novel parallel classification network for classifying three-dimensional surface with point cloud data," Journal of Intelligent Manufacturing, Springer, vol. 34(2), pages 515-527, February.

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