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Three-dimensional integration of nanotechnologies for computing and data storage on a single chip

Author

Listed:
  • Max M. Shulaker

    (Stanford University
    Massachusetts Institute of Technology)

  • Gage Hills

    (Stanford University)

  • Rebecca S. Park

    (Stanford University)

  • Roger T. Howe

    (Stanford University)

  • Krishna Saraswat

    (Stanford University)

  • H.-S. Philip Wong

    (Stanford University)

  • Subhasish Mitra

    (Stanford University
    Stanford University)

Abstract

Multiple nanotechnologies are integrated on a single chip to realize a three-dimensional integrated circuit architecture that combines computing and data storage—a potentially transformative advance in computing.

Suggested Citation

  • Max M. Shulaker & Gage Hills & Rebecca S. Park & Roger T. Howe & Krishna Saraswat & H.-S. Philip Wong & Subhasish Mitra, 2017. "Three-dimensional integration of nanotechnologies for computing and data storage on a single chip," Nature, Nature, vol. 547(7661), pages 74-78, July.
    • Handle: RePEc:nat:nature:v:547:y:2017:i:7661:d:10.1038_nature22994
    DOI: 10.1038/nature22994
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    Cited by:

    1. Wei Su & Xiao Li & Linhai Li & Dehua Yang & Futian Wang & Xiaojun Wei & Weiya Zhou & Hiromichi Kataura & Sishen Xie & Huaping Liu, 2023. "Chirality-dependent electrical transport properties of carbon nanotubes obtained by experimental measurement," Nature Communications, Nature, vol. 14(1), pages 1-9, December.
    2. Fernando Aguirre & Abu Sebastian & Manuel Gallo & Wenhao Song & Tong Wang & J. Joshua Yang & Wei Lu & Meng-Fan Chang & Daniele Ielmini & Yuchao Yang & Adnan Mehonic & Anthony Kenyon & Marco A. Villena, 2024. "Hardware implementation of memristor-based artificial neural networks," Nature Communications, Nature, vol. 15(1), pages 1-40, December.
    3. Yijun Li & Jianshi Tang & Bin Gao & Jian Yao & Anjunyi Fan & Bonan Yan & Yuchao Yang & Yue Xi & Yuankun Li & Jiaming Li & Wen Sun & Yiwei Du & Zhengwu Liu & Qingtian Zhang & Song Qiu & Qingwen Li & He, 2023. "Monolithic three-dimensional integration of RRAM-based hybrid memory architecture for one-shot learning," Nature Communications, Nature, vol. 14(1), pages 1-9, December.
    4. Wenhui Wang & Ke Li & Jun Lan & Mei Shen & Zhongrui Wang & Xuewei Feng & Hongyu Yu & Kai Chen & Jiamin Li & Feichi Zhou & Longyang Lin & Panpan Zhang & Yida Li, 2023. "CMOS backend-of-line compatible memory array and logic circuitries enabled by high performance atomic layer deposited ZnO thin-film transistor," Nature Communications, Nature, vol. 14(1), pages 1-11, December.
    5. Maosong Xie & Yueyang Jia & Chen Nie & Zuheng Liu & Alvin Tang & Shiquan Fan & Xiaoyao Liang & Li Jiang & Zhezhi He & Rui Yang, 2023. "Monolithic 3D integration of 2D transistors and vertical RRAMs in 1T–4R structure for high-density memory," Nature Communications, Nature, vol. 14(1), pages 1-11, December.
    6. Yuxuan Zhang & You Meng & Liqiang Wang & Changyong Lan & Quan Quan & Wei Wang & Zhengxun Lai & Weijun Wang & Yezhan Li & Di Yin & Dengji Li & Pengshan Xie & Dong Chen & Zhe Yang & SenPo Yip & Yang Lu , 2024. "Pulse irradiation synthesis of metal chalcogenides on flexible substrates for enhanced photothermoelectric performance," Nature Communications, Nature, vol. 15(1), pages 1-9, December.

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