Exploring the Technological Collaboration Characteristics of the Global Integrated Circuit Manufacturing Industry
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- Jianqi Mao & Xiaxia Guo, 2021. "Analysis of the Dynamic Landscape of Scientific Innovation in the Chip Domain," International Business Research, Canadian Center of Science and Education, vol. 14(12), pages 1-1, December.
- Wentian Shi & Wenlong Yang & Debin Du, 2020. "The Scientific Cooperation Network of Chinese Scientists and Its Proximity Mechanism," Sustainability, MDPI, vol. 12(2), pages 1-18, January.
- Yuan Yuan & Jinli Guo & Zhaohua Guo, 2023. "An Evolutionary Analysis of Higher-Order Interaction Collaborative Innovation Networks in China’s New Energy Vehicle Industry," Sustainability, MDPI, vol. 15(15), pages 1-23, July.
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Keywords
international technological collaboration; IC manufacturing; patent association analysis; social network analysis; collaboration network;All these keywords.
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