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Optimization of MOSFET Copper Clip to Enhance Thermal Management Using Kriging Surrogate Model and Genetic Algorithm

Author

Listed:
  • Yubin Cheon

    (Department of Mechanical Engineering, Dongguk University-Seoul, 30 Pildong-ro 1-gil, Jung-gu, Seoul 04620, Republic of Korea)

  • Jaehyun Jung

    (Department of Mechanical Engineering, Dongguk University-Seoul, 30 Pildong-ro 1-gil, Jung-gu, Seoul 04620, Republic of Korea)

  • Daeyeon Ki

    (Department of Mechanical Engineering, Dongguk University-Seoul, 30 Pildong-ro 1-gil, Jung-gu, Seoul 04620, Republic of Korea)

  • Salman Khalid

    (Department of Mechanical, Robotics and Energy Engineering, Dongguk University-Seoul, 30 Pildong-ro 1-gil, Jung-gu, Seoul 04620, Republic of Korea)

  • Heung Soo Kim

    (Department of Mechanical, Robotics and Energy Engineering, Dongguk University-Seoul, 30 Pildong-ro 1-gil, Jung-gu, Seoul 04620, Republic of Korea)

Abstract

Metal–oxide–semiconductor field-effect transistors (MOSFETs) are critical in power electronic modules due to their high-power density and rapid switching capabilities. Therefore, effective thermal management is crucial for ensuring reliability and superior performance. This study used finite element analysis (FEA) to evaluate the electro-thermal behavior of MOSFETs with copper clip bonding, showing a significant improvement over aluminum wire bonding. The aluminum wire model reached a maximum temperature of 102.8 °C, while the copper clip reduced this to 74.6 °C. To further optimize the thermal performance, Latin Hypercube Sampling (LHS) generated diverse design points. The FEA results were used to select the Kriging regression model, chosen for its superior accuracy ( MSE = 0.036, R 2 = 0.997, adjusted R 2 = 0.997). The Kriging model was integrated with a Genetic Algorithm (GA), further reducing the maximum temperature to 71.5 °C, a 4.20% improvement over the original copper clip design and a 43.8% reduction compared to aluminum wire bonding. This integration of Kriging and the GA to the MOSFET copper clip package led to a significant improvement in the heat dissipation and overall thermal performance of the MOSFET package, while also reducing the computational power requirements, providing a reliable and efficient solution for the optimization of MOSFET copper clip packages.

Suggested Citation

  • Yubin Cheon & Jaehyun Jung & Daeyeon Ki & Salman Khalid & Heung Soo Kim, 2024. "Optimization of MOSFET Copper Clip to Enhance Thermal Management Using Kriging Surrogate Model and Genetic Algorithm," Mathematics, MDPI, vol. 12(18), pages 1-21, September.
    • Handle: RePEc:gam:jmathe:v:12:y:2024:i:18:p:2949-:d:1483182
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    References listed on IDEAS

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    1. Yudong Zhang & Shuihua Wang & Genlin Ji, 2015. "A Comprehensive Survey on Particle Swarm Optimization Algorithm and Its Applications," Mathematical Problems in Engineering, Hindawi, vol. 2015, pages 1-38, October.
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