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Influence of Hydrophobic Fin Configuration in Thermal System in Relation to Electronic Device Cooling Applications

Author

Listed:
  • Shahzada Zaman Shuja

    (ME Department, King Fahd University of Petroleum and Minerals, Box 1913, Dhahran 31261, Saudi Arabia)

  • Bekir Sami Yilbas

    (ME Department, King Fahd University of Petroleum and Minerals, Box 1913, Dhahran 31261, Saudi Arabia
    Center of Excellence in Renewable Energy, King Fahd University of Petroleum and Minerals, Dhahran 31261, Saudi Arabia
    K.A.CARE Energy Research & Innovation Center, Dhahran 31261, Saudi Arabia)

  • Hussain Al-Qahtani

    (ME Department, King Fahd University of Petroleum and Minerals, Box 1913, Dhahran 31261, Saudi Arabia)

Abstract

In this study, heat and flow analysis of the cooling system incorporating fins with hydrophilic and hydrophobic wetting surfaces has been considered in relation to electronic cooling applications. Temperature and velocity fields in the solution domain are simulated for various fin numbers and sizes. A temperature parameter is introduced to assess the thermal performance of the system. Fin count is introduced to formulate the number of fins in the solution domain. The Nusselt number and pressure drop between the inlet and exit ports due to different fin configurations of the cooling system for various fin counts are presented. It is found that the temperature parameter attains high values for large sizes and small fin counts, which is more pronounced for low Reynolds numbers. Increasing number of fins results in almost uniform flow distribution among the fin, which is more pronounced for the hydrophobic fin configuration. The Nusselt number attains larger values for the hydrophilic fin configuration than that corresponding to the hydrophobic fin, and it attains a peak value for certain arrangement of fin count, which differs with the Reynolds number. The pressure drop between the inlet and exit ports reduces for hydrophobic fin; hence the slip velocity introduced for hydrophobic fin improves the pressure drop by 6% to 16% depending on the fin counts in the cooling system.

Suggested Citation

  • Shahzada Zaman Shuja & Bekir Sami Yilbas & Hussain Al-Qahtani, 2020. "Influence of Hydrophobic Fin Configuration in Thermal System in Relation to Electronic Device Cooling Applications," Energies, MDPI, vol. 13(7), pages 1-19, April.
    • Handle: RePEc:gam:jeners:v:13:y:2020:i:7:p:1631-:d:340283
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    References listed on IDEAS

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    1. Jin-Cherng Shyu & Tsuni Chang & Shun-Ching Lee, 2017. "A Numerical Study on Natural Convection Heat Transfer of Handheld Projectors with a Fin Array," Energies, MDPI, vol. 10(3), pages 1-17, February.
    2. Edalatpour, M. & Liu, L. & Jacobi, A.M. & Eid, K.F. & Sommers, A.D., 2018. "Managing water on heat transfer surfaces: A critical review of techniques to modify surface wettability for applications with condensation or evaporation," Applied Energy, Elsevier, vol. 222(C), pages 967-992.
    3. Miao Qian & Jie Li & Zhong Xiang & Chao Yan & Xudong Hu, 2019. "Effect of Pin Diameter Degressive Gradient on Heat Transfer in a Microreactor with Non-Uniform Pin-Fin Array under Low Reynolds Number Conditions," Energies, MDPI, vol. 12(14), pages 1-12, July.
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