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Thermal Characterization of a Heat Management Module Containing Microencapsulated Phase Change Material

Author

Listed:
  • H.M. Shih

    (Department of Mechanical Engineering, Southern Taiwan University of Science and Technology, Tainan 710, Taiwan)

  • Yi-Pin Lin

    (Department of Creative Design, National Yunlin University of Science and Technology, Douliou 640, Taiwan)

  • L.P. Lin

    (Department of Mechanical Engineering, Southern Taiwan University of Science and Technology, Tainan 710, Taiwan)

  • Chi-Ming Lai

    (Department of Civil Engineering, National Cheng Kung University, Tainan 701, Taiwan)

Abstract

In this study, a heat management module containing a microencapsulated phase change material (mPCM) was fabricated from mPCM (core material: paraffin; melting temperature: 37 °C) and aluminum honeycomb structures (8 mm core cell). The aluminum honeycomb functioned both as structural support and as a heat transfer channel. The thermal management performance of the proposed module under constant-temperature boundary conditions was investigated experimentally. The thermal protection period of the module decreased as the Stefan number increased; however, increasing the subcooling factor could effectively enhance the thermal protection performance. When the cold-wall temperature T C was fixed at 17 °C and the initial hot wall temperature was 47–67 °C, the heat dissipation of the module was complete 140 min after the hot-wall heat supply was stopped. The time required to complete the heat dissipation increased to 280 min when T C increased to 27 °C.

Suggested Citation

  • H.M. Shih & Yi-Pin Lin & L.P. Lin & Chi-Ming Lai, 2019. "Thermal Characterization of a Heat Management Module Containing Microencapsulated Phase Change Material," Energies, MDPI, vol. 12(11), pages 1-13, June.
    • Handle: RePEc:gam:jeners:v:12:y:2019:i:11:p:2164-:d:237670
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    References listed on IDEAS

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