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Experimental study and Taguchi analysis on LED cooling by thermoelectric cooler integrated with microchannel heat sink

Author

Listed:
  • Lin, Xiaohui
  • Mo, Songping
  • Jia, Lisi
  • Yang, Zhi
  • Chen, Ying
  • Cheng, Zhengdong

Abstract

Effective thermal management is crucial for light-emitting diodes (LED). Thermoelectric cooler (TEC) and microchannel heat sink (MHS) have been demonstrated to be effective for thermal management of LED. However, neither the combination of these two methods, nor the dominant factors which could be effectively adjusted to control the LED temperature, have been reported. In this study, a cooling device integrating TEC and water-cooled microchannel heat sink (WMHS) is proposed to improve the thermal management of high-power LED headlights. The start-up performance of the proposed device, LED + TEC + WMHS, was evaluated and compared with three different systems, namely LED + WMHS, LED + AHS (air-cooled heat sink), and LED + TEC + AHS. Experimental results have demonstrated the best performance of the LED + TEC + WMHS device. Orthogonal experiments based on the Taguchi method were conducted to reveal dominant factors among four variables, including TEC current, water inlet temperature, water flow velocity, and ambient temperature. The results show that effects of all the factors were significant while the TEC current has most important influence on the performance. The variation of the thermal management performance with the levels of the factors were investigated. The LED temperature was only 60.0 °C even at severe working conditions (Ta = 80 °C, Ti = 55 °C) and moderate cooling input (ITEC = 2 A, u = 0.49 m/s), indicating great thermal management performance of the proposed method. Choosing a cooling system and adjusting the factor levels for different applications were recommended.

Suggested Citation

  • Lin, Xiaohui & Mo, Songping & Jia, Lisi & Yang, Zhi & Chen, Ying & Cheng, Zhengdong, 2019. "Experimental study and Taguchi analysis on LED cooling by thermoelectric cooler integrated with microchannel heat sink," Applied Energy, Elsevier, vol. 242(C), pages 232-238.
    • Handle: RePEc:eee:appene:v:242:y:2019:i:c:p:232-238
    DOI: 10.1016/j.apenergy.2019.03.071
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    References listed on IDEAS

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    1. Schmid, Gerd & Huang, Zun-Long & Yang, Tai-Her & Chen, Sih-Li, 2017. "Numerical analysis of a vertical double-pipe single-flow heat exchanger applied in an active cooling system for high-power LED street lights," Applied Energy, Elsevier, vol. 195(C), pages 426-438.
    2. Chen, Wei-Hsin & Huang, Shih-Rong & Lin, Yu-Li, 2015. "Performance analysis and optimum operation of a thermoelectric generator by Taguchi method," Applied Energy, Elsevier, vol. 158(C), pages 44-54.
    3. Jang, Daeseok & Yook, Se-Jin & Lee, Kwan-Soo, 2014. "Optimum design of a radial heat sink with a fin-height profile for high-power LED lighting applications," Applied Energy, Elsevier, vol. 116(C), pages 260-268.
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    Cited by:

    1. Zhang, Jun & Du, Xiong & Qian, Cheng, 2021. "Lifetime improvement for wind power generation system based on optimal effectiveness of thermal management," Applied Energy, Elsevier, vol. 286(C).
    2. He, Wei & Yin, Ershuai & Zhou, Fan & Zhao, Yang & Hu, Dinghua & Li, Jiaqi & Li, Qiang, 2024. "Integrated manifold microchannels and near-junction cooling for enhanced thermal management in 3D heterogeneous packaging technology," Energy, Elsevier, vol. 305(C).
    3. Mo, Songping & Ye, Jiarong & Jia, Lisi & Chen, Ying, 2022. "Properties and performance of hybrid suspensions of MPCM/nanoparticles for LED thermal management," Energy, Elsevier, vol. 239(PE).
    4. He, Ziqiang & Yan, Yunfei & Zhang, Zhien, 2021. "Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review," Energy, Elsevier, vol. 216(C).
    5. Sungjoon Byun & Seounghwan Hyeon & Kwan-Soo Lee, 2022. "Guide Vane for Thermal Enhancement of a LED Heat Sink," Energies, MDPI, vol. 15(7), pages 1-13, March.
    6. Cristina Morel & Jean-Yves Morel, 2024. "Power Semiconductor Junction Temperature and Lifetime Estimations: A Review," Energies, MDPI, vol. 17(18), pages 1-29, September.

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