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Computer engineering: Feeling the heat

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  • Philip Ball

    (Philip Ball is a writer based in London.)

Abstract

The more that microcircuits are shrunk, the hotter they get. Engineers are on the hunt for ways to cool off computing.

Suggested Citation

  • Philip Ball, 2012. "Computer engineering: Feeling the heat," Nature, Nature, vol. 492(7428), pages 174-176, December.
    • Handle: RePEc:nat:nature:v:492:y:2012:i:7428:d:10.1038_492174a
    DOI: 10.1038/492174a
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    Cited by:

    1. Ming-Ding Li & Xiao-Quan Shen & Xin Chen & Jia-Ming Gan & Fang Wang & Jian Li & Xiao-Liang Wang & Qun-Dong Shen, 2022. "Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration," Nature Communications, Nature, vol. 13(1), pages 1-8, December.
    2. Fangqi Liu & Lei Jia & Jiaxin Zhang & Zhendong Yang & Yanni Wei & Nannan Zhang & Zhenlin Lu, 2024. "Numerical Study on Heat Transfer Efficiency and Inter-Layer Stress of Microchannel Heat Sinks with Different Geometries," Energies, MDPI, vol. 17(20), pages 1-21, October.

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