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Numerical Study on Heat Transfer Efficiency and Inter-Layer Stress of Microchannel Heat Sinks with Different Geometries

Author

Listed:
  • Fangqi Liu

    (School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China)

  • Lei Jia

    (School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China)

  • Jiaxin Zhang

    (School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China)

  • Zhendong Yang

    (State Key Laboratory of Eco-Hydraulics in Northwest Arid Region of China, Xi’an University of Technology, Xi’an 710048, China)

  • Yanni Wei

    (School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China)

  • Nannan Zhang

    (School of Materials Science and Engineering, Shenyang University of Technology, Shenyang 110870, China)

  • Zhenlin Lu

    (School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China)

Abstract

As electronics become more powerful and compact, laminated microchannel heat sinks (MCHSs) are essential for handling high heat flux. This study aims to optimize the MCHS design for improved heat dissipation and structural strength. An orthogonal experiment was established with the average surface temperature of the heat source as the evaluation metric, and the optimal structure was determined through simulation. Finally, cooling uniformity, fluidity, and performance evaluation criterion ( PEC ) analyses were carried out on the optimal structure. It was determined that the optimal combination was the triangular cavity microchannel (MCTC), with a microchannel width of 0.5 mm, a microchannel distribution density of 60%, and the presence of surface undulation on the microchannels. The result shows that the optimal structure’s peak inter-layer stress is just 34.8% of its longitudinal tensile strength. Compared to the traditional parallel straight microchannel (MCPS), this structure boasts an 8.6 K decrease in the average surface temperature and a temperature variation along specific paths that is only 9.9% of that in traditional designs. Moreover, the optimal design cuts the velocity loss at the microchannel entrance from 75% to 59%. Thus, this research successfully develops an effective optimization strategy for MCHSs.

Suggested Citation

  • Fangqi Liu & Lei Jia & Jiaxin Zhang & Zhendong Yang & Yanni Wei & Nannan Zhang & Zhenlin Lu, 2024. "Numerical Study on Heat Transfer Efficiency and Inter-Layer Stress of Microchannel Heat Sinks with Different Geometries," Energies, MDPI, vol. 17(20), pages 1-21, October.
    • Handle: RePEc:gam:jeners:v:17:y:2024:i:20:p:5076-:d:1497283
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    References listed on IDEAS

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    1. Hamza Djeloud & Mustafa Moussaoui & Rahmani Kouider & Awf Al-Kassir & Juan Pablo Carrasco-Amador, 2023. "Study of the Heat Exchange and Relaxation Conditions of Residual Stresses Due to Welding of Austenitic Stainless Steel," Energies, MDPI, vol. 16(7), pages 1-20, March.
    2. Philip Ball, 2012. "Computer engineering: Feeling the heat," Nature, Nature, vol. 492(7428), pages 174-176, December.
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