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Self-assembled three dimensional network designs for soft electronics

Author

Listed:
  • Kyung-In Jang

    (Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
    Daegu Gyeongbuk Institute of Science and Technology (DGIST))

  • Kan Li

    (Mechanical Engineering, and Materials Science and Engineering, Northwestern University)

  • Ha Uk Chung

    (Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
    Northwestern University)

  • Sheng Xu

    (University of California at San Diego)

  • Han Na Jung

    (Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign)

  • Yiyuan Yang

    (Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign)

  • Jean Won Kwak

    (Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign)

  • Han Hee Jung

    (Daegu Gyeongbuk Institute of Science and Technology (DGIST))

  • Juwon Song

    (Daegu Gyeongbuk Institute of Science and Technology (DGIST))

  • Ce Yang

    (Center for Mechanics and Materials, AML, Tsinghua University)

  • Ao Wang

    (Mechanical Engineering, and Materials Science and Engineering, Northwestern University
    Center for Mechanics and Materials, AML, Tsinghua University)

  • Zhuangjian Liu

    (Institute of High Performance Computing)

  • Jong Yoon Lee

    (Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
    Daegu Gyeongbuk Institute of Science and Technology (DGIST))

  • Bong Hoon Kim

    (Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign)

  • Jae-Hwan Kim

    (Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign)

  • Jungyup Lee

    (Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign)

  • Yongjoon Yu

    (Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign)

  • Bum Jun Kim

    (Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign)

  • Hokyung Jang

    (Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign)

  • Ki Jun Yu

    (School of Electrical and Electronic Engineering, Yonsei University)

  • Jeonghyun Kim

    (Kwangwoon University)

  • Jung Woo Lee

    (Pusan National University)

  • Jae-Woong Jeong

    (Computer and Energy Engineering, University of Colorado)

  • Young Min Song

    (School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology)

  • Yonggang Huang

    (Mechanical Engineering, and Materials Science and Engineering, Northwestern University)

  • Yihui Zhang

    (Center for Mechanics and Materials, AML, Tsinghua University)

  • John A. Rogers

    (Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Neurological Surgery, Center for Bio-Integrated Electronics, Simpson Querrey Institute for BioNanotechnology, McCormick School of Engineering and Feinberg School of Medicine, Northwestern University)

Abstract

Low modulus, compliant systems of sensors, circuits and radios designed to intimately interface with the soft tissues of the human body are of growing interest, due to their emerging applications in continuous, clinical-quality health monitors and advanced, bioelectronic therapeutics. Although recent research establishes various materials and mechanics concepts for such technologies, all existing approaches involve simple, two-dimensional (2D) layouts in the constituent micro-components and interconnects. Here we introduce concepts in three-dimensional (3D) architectures that bypass important engineering constraints and performance limitations set by traditional, 2D designs. Specifically, open-mesh, 3D interconnect networks of helical microcoils formed by deterministic compressive buckling establish the basis for systems that can offer exceptional low modulus, elastic mechanics, in compact geometries, with active components and sophisticated levels of functionality. Coupled mechanical and electrical design approaches enable layout optimization, assembly processes and encapsulation schemes to yield 3D configurations that satisfy requirements in demanding, complex systems, such as wireless, skin-compatible electronic sensors.

Suggested Citation

  • Kyung-In Jang & Kan Li & Ha Uk Chung & Sheng Xu & Han Na Jung & Yiyuan Yang & Jean Won Kwak & Han Hee Jung & Juwon Song & Ce Yang & Ao Wang & Zhuangjian Liu & Jong Yoon Lee & Bong Hoon Kim & Jae-Hwan , 2017. "Self-assembled three dimensional network designs for soft electronics," Nature Communications, Nature, vol. 8(1), pages 1-10, August.
  • Handle: RePEc:nat:natcom:v:8:y:2017:i:1:d:10.1038_ncomms15894
    DOI: 10.1038/ncomms15894
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    Cited by:

    1. Chunpeng Jiang & Wenqiang Xu & Yutong Li & Zhenjun Yu & Longchun Wang & Xiaotong Hu & Zhengyi Xie & Qingkun Liu & Bin Yang & Xiaolin Wang & Wenxin Du & Tutian Tang & Dongzhe Zheng & Siqiong Yao & Cewu, 2024. "Capturing forceful interaction with deformable objects using a deep learning-powered stretchable tactile array," Nature Communications, Nature, vol. 15(1), pages 1-14, December.

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