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An impermeable copper surface monolayer with high-temperature oxidation resistance

Author

Listed:
  • Su Jae Kim

    (Pusan National University)

  • Young-Hoon Kim

    (Sungkyunkwan University
    Oak Ridge National Laboratory)

  • Bipin Lamichhane

    (Mississippi State University
    Mississippi State University)

  • Binod Regmi

    (Mississippi State University
    Mississippi State University)

  • Yousil Lee

    (Copper Innovative Technology (CIT) Co.)

  • Sang-Hyeok Yang

    (Sungkyunkwan University)

  • Seon Je Kim

    (Sungkyunkwan University)

  • Min-Hyoung Jung

    (Sungkyunkwan University)

  • Jae Hyuck Jang

    (Korea Basic Science Institute (KBSI))

  • Hu Young Jeong

    (Ulsan National Institute of Science and Technology)

  • Miaofang Chi

    (Oak Ridge National Laboratory)

  • Maeng-Je Seong

    (Chung-Ang University)

  • Hak Soo Choi

    (Massachusetts General Hospital and Harvard Medical School)

  • Seong-Gon Kim

    (Mississippi State University
    Mississippi State University)

  • Young-Min Kim

    (Sungkyunkwan University
    Institute for Basic Science (IBS))

  • Se-Young Jeong

    (Massachusetts General Hospital and Harvard Medical School
    Korea Advanced Institute of Science and Technology (KAIST)
    Pusan National University)

Abstract

Despite numerous efforts involving surface coating, doping, and alloying, maintaining surface stability of metal at high temperatures without compromising intrinsic properties has remained challenging. Here, we present a pragmatic method to address the accelerated oxidation of Cu, Ni, and Fe at temperatures exceeding 200 °C. Inspired by the concept that oxygen (O) itself can effectively obstruct the pathway of O infiltration, this study proposes the immobilization of O on the metal surface. Through extensive calculations considering various elements (C, Al, Si, Ge, Ga, In, and Sn) to anchor O on Cu surfaces, Si emerges as the optimal element. The theoretical findings are validated through systematic sputtering deposition experiments. The introduction of anchoring elements to reinforce Cu–O bonds enables the formation of an atomically thin barrier on the Cu surface, rendering it impermeable to O even at high temperatures (400 °C) while preserving its intrinsic conductivity. This oxidation resistance, facilitated by the impermeable atomic monolayer, opens promising opportunities for researchers and industries to overcome limitations associated with the use of oxidizable metal films.

Suggested Citation

  • Su Jae Kim & Young-Hoon Kim & Bipin Lamichhane & Binod Regmi & Yousil Lee & Sang-Hyeok Yang & Seon Je Kim & Min-Hyoung Jung & Jae Hyuck Jang & Hu Young Jeong & Miaofang Chi & Maeng-Je Seong & Hak Soo , 2025. "An impermeable copper surface monolayer with high-temperature oxidation resistance," Nature Communications, Nature, vol. 16(1), pages 1-11, December.
  • Handle: RePEc:nat:natcom:v:16:y:2025:i:1:d:10.1038_s41467-025-56709-w
    DOI: 10.1038/s41467-025-56709-w
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    References listed on IDEAS

    as
    1. Jian Peng & Bili Chen & Zhichang Wang & Jing Guo & Binghui Wu & Shuqiang Hao & Qinghua Zhang & Lin Gu & Qin Zhou & Zhi Liu & Shuqin Hong & Sifan You & Ang Fu & Zaifa Shi & Hao Xie & Duanyun Cao & Chan, 2020. "Surface coordination layer passivates oxidation of copper," Nature, Nature, vol. 586(7829), pages 390-394, October.
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