Author
Listed:
- Mao-Lin Chen
(Institute of Metal Research, Chinese Academy of Sciences
University of Science and Technology of China)
- Xingdan Sun
(Institute of Metal Research, Chinese Academy of Sciences
University of Science and Technology of China)
- Hang Liu
(Hunan University)
- Hanwen Wang
(Institute of Metal Research, Chinese Academy of Sciences
University of Science and Technology of China)
- Qianbing Zhu
(Institute of Metal Research, Chinese Academy of Sciences
University of Science and Technology of China)
- Shasha Wang
(High Magnetic Field Laboratory and University of Science and Technology of China, Chinese Academy of Science (CAS))
- Haifeng Du
(High Magnetic Field Laboratory and University of Science and Technology of China, Chinese Academy of Science (CAS))
- Baojuan Dong
(Shanxi University
Shanxi University)
- Jing Zhang
(Shanxi University
Shanxi University)
- Yun Sun
(Institute of Metal Research, Chinese Academy of Sciences
University of Science and Technology of China)
- Song Qiu
(Suzhou Institute of Nanotech and Nanobionics, Chinese Academy of Science)
- Thomas Alava
(Université Grenoble Alpes, CEA, LETI)
- Song Liu
(Hunan University)
- Dong-Ming Sun
(Institute of Metal Research, Chinese Academy of Sciences
University of Science and Technology of China)
- Zheng Han
(Institute of Metal Research, Chinese Academy of Sciences
University of Science and Technology of China
Shanxi University
Shanxi University)
Abstract
Since its invention in the 1960s, one of the most significant evolutions of metal-oxide-semiconductor field effect transistors (MOS-FETs) would be the three dimensionalized version that makes the semiconducting channel vertically wrapped by conformal gate electrodes, also recognized as FinFET. During the past decades, the width of fin (W$${}_{{\rm{fin}}}$$fin) in FinFETs has shrunk from about 150 nm to a few nanometers. However, W$${}_{{\rm{fin}}}$$fin seems to have been levelling off in recent years, owing to the limitation of lithography precision. Here, we show that by adapting a template-growth method, different types of mono-layered two-dimensional crystals are isolated in a vertical manner. Based on this, FinFETs with one atomic layer fin are obtained, with on/off ratios reaching $$\sim\!\! 10^{7}$$~107. Our findings push the FinFET to the sub 1 nm fin-width limit, and may shed light on the next generation nanoelectronics for higher integration and lower power consumption.
Suggested Citation
Mao-Lin Chen & Xingdan Sun & Hang Liu & Hanwen Wang & Qianbing Zhu & Shasha Wang & Haifeng Du & Baojuan Dong & Jing Zhang & Yun Sun & Song Qiu & Thomas Alava & Song Liu & Dong-Ming Sun & Zheng Han, 2020.
"A FinFET with one atomic layer channel,"
Nature Communications, Nature, vol. 11(1), pages 1-7, December.
Handle:
RePEc:nat:natcom:v:11:y:2020:i:1:d:10.1038_s41467-020-15096-0
DOI: 10.1038/s41467-020-15096-0
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Citations
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Cited by:
- Ning Xu & Li Shi & Xudong Pei & Weiyang Zhang & Jian Chen & Zheng Han & Paolo Samorì & Jinlan Wang & Peng Wang & Yi Shi & Songlin Li, 2023.
"Oxidation kinetics and non-Marcusian charge transfer in dimensionally confined semiconductors,"
Nature Communications, Nature, vol. 14(1), pages 1-9, December.
- Mengshi Yu & Congwei Tan & Yuling Yin & Junchuan Tang & Xiaoyin Gao & Hongtao Liu & Feng Ding & Hailin Peng, 2024.
"Integrated 2D multi-fin field-effect transistors,"
Nature Communications, Nature, vol. 15(1), pages 1-11, December.
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