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Sequential Screening in Semiconductor Manufacturing, II: Exploiting Lot-to-Lot Variability

Author

Listed:
  • Jihong Ou

    (National University of Singapore, Singapore)

  • Lawrence M. Wein

    (Massachusetts Institute of Technology, Cambridge, Massachusetts)

Abstract

This paper addresses the same quality management problem as Longtin, Wein and Welsch (Longtin, M., L. M. Wein, R. E. Welsch. 1996. Sequential screening in semiconductor manufacturing, I: Exploiting spatial dependence. Opns. Res. 44 173–195.), except that here screening is performed at the wafer level, rather than at the chip level. An empirical Bayes approach is employed: The number of bad chips on a wafer is assumed to be a gamma random variable, where the scale parameter is unknown and varies from lot to lot according to another gamma distribution. We fit the yield model to industrial data and test the optimal policy on these data. The numerical results suggest that screening at the chip level, as in Longtin, Wein and Welsch, is significantly more profitable than screening at the wafer level.

Suggested Citation

  • Jihong Ou & Lawrence M. Wein, 1996. "Sequential Screening in Semiconductor Manufacturing, II: Exploiting Lot-to-Lot Variability," Operations Research, INFORMS, vol. 44(1), pages 196-205, February.
    • Handle: RePEc:inm:oropre:v:44:y:1996:i:1:p:196-205
    DOI: 10.1287/opre.44.1.196
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    Citations

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    Cited by:

    1. Chun, Young H., 2016. "Designing repetitive screening procedures with imperfect inspections: An empirical Bayes approach," European Journal of Operational Research, Elsevier, vol. 253(3), pages 639-647.
    2. David D. Yao & Shaohui Zheng, 1999. "Sequential Inspection Under Capacity Constraints," Operations Research, INFORMS, vol. 47(3), pages 410-421, June.
    3. Morris A. Cohen & Yu-Sheng Zheng & Yunzeng Wang, 1999. "Identifying Opportunities for Improving Teradyne's Service-Parts Logistics System," Interfaces, INFORMS, vol. 29(4), pages 1-18, August.
    4. Yimin Wang, 2013. "Specification vagueness and supply quality risk," Naval Research Logistics (NRL), John Wiley & Sons, vol. 60(3), pages 222-236, April.

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