IDEAS home Printed from https://ideas.repec.org/a/gam/jeners/v16y2023i18p6464-d1234976.html
   My bibliography  Save this article

Experimental Investigation on Thermal Performance of Vapor Chambers with Diffident Wick Structures

Author

Listed:
  • Yujuan Xia

    (Jiangsu Key Laboratory of Micro and Nano Heat Fluid Flow Technology and Energy Application, School of Environmental Science and Engineering, Suzhou University of Science and Technology, Suzhou 215009, China)

  • Feng Yao

    (Jiangsu Key Laboratory of Micro and Nano Heat Fluid Flow Technology and Energy Application, School of Environmental Science and Engineering, Suzhou University of Science and Technology, Suzhou 215009, China)

  • Mengxiang Wang

    (China National Institute of Standardization, Beijing 100088, China)

Abstract

In this paper, a type of vapor chamber with a gradient pore size wick (VC-G) was developed, and its thermal performance was experimentally tested and compared with two types of VCs with uniform pore size wick (which can be defined as VC-U (200) and VC-U (50) as the powder size of the wick is 50-mesh and 200-mesh, respectively) and a VC without a wick (VC-N). In addition, a VC heat transfer ability experiment platform was built, and the thermal resistance, temperature distribution and thermal response time of the VC with different wick structures were experimentally investigated. The experiment results show that the capillary driving force provided by gradient pore size wick increases gradually from outside, which can not only promote the condensation fluid to gather in the central heat source but also facilitate the vapor to spread around. Therefore, compared with VC-U (200), VC-U (50) and VC-N, VC-G shows the best heat transfer performance, temperature uniform performance and start-up performance.

Suggested Citation

  • Yujuan Xia & Feng Yao & Mengxiang Wang, 2023. "Experimental Investigation on Thermal Performance of Vapor Chambers with Diffident Wick Structures," Energies, MDPI, vol. 16(18), pages 1-16, September.
    • Handle: RePEc:gam:jeners:v:16:y:2023:i:18:p:6464-:d:1234976
    as

    Download full text from publisher

    File URL: https://www.mdpi.com/1996-1073/16/18/6464/pdf
    Download Restriction: no
    File URL: https://www.mdpi.com/1996-1073/16/18/6464/
    Download Restriction: no
    ---><---

    References listed on IDEAS

    as
    1. Liangyu Wu & Xiaotian Han & Chenxi Shao & Feng Yao & Weibo Yang, 2019. "Thermal Fatigue Modelling and Simulation of Flip Chip Component Solder Joints under Cyclic Thermal Loading," Energies, MDPI, vol. 12(12), pages 1-13, June.
    Full references (including those not matched with items on IDEAS)

    Most related items

    These are the items that most often cite the same works as this one and are cited by the same works as this one.

      Corrections

      All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:gam:jeners:v:16:y:2023:i:18:p:6464-:d:1234976. See general information about how to correct material in RePEc.

      If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

      If CitEc recognized a bibliographic reference but did not link an item in RePEc to it, you can help with this form .

      If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

      For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: MDPI Indexing Manager (email available below). General contact details of provider: https://www.mdpi.com .

      Please note that corrections may take a couple of weeks to filter through the various RePEc services.

      IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.