IDEAS home Printed from https://ideas.repec.org/a/gam/jeners/v13y2020i9p2252-d353791.html
   My bibliography  Save this article

TRIC: A Thermal Resistance and Impedance Calculator for Electronic Packages

Author

Listed:
  • Lorenzo Codecasa

    (Department of Electronics, Information and Bioengineering, Politecnico di Milano, 20133 Milan, Italy)

  • Francesca De Viti

    (STMicroelectronics, 20864 Agrate Brianza, Italy)

  • Vincenzo d’Alessandro

    (Department of Electrical Engineering and Information Technology, University Federico II, 80125 Naples, Italy)

  • Donata Gualandris

    (STMicroelectronics, 20864 Agrate Brianza, Italy)

  • Arianna Morelli

    (STMicroelectronics, 20864 Agrate Brianza, Italy)

  • Claudio Maria Villa

    (STMicroelectronics, 20864 Agrate Brianza, Italy)

Abstract

This paper presents the Thermal Resistance and Impedance Calculator (TRIC) tool devised for the automatic extraction of thermal metrics of package families of electronic components in both static and transient conditions. TRIC relies on a solution algorithm based on a novel projection-based approach, which—unlike previous techniques—allows (i) dealing with parametric detailed thermal models (pDTMs) of package families that exhibit generic non-Manhattan variations of geometries and meshes, and (ii) transforming such pDTMs into compact thermal models that can be solved in short times. Thermal models of several package families are available, and dies with multiple active areas can be handled. It is shown that transient thermal responses of chosen packages can be obtained in a CPU (central processing unit) time much shorter than that required by a widely used software relying on the finite-volume method without sacrificing accuracy.

Suggested Citation

  • Lorenzo Codecasa & Francesca De Viti & Vincenzo d’Alessandro & Donata Gualandris & Arianna Morelli & Claudio Maria Villa, 2020. "TRIC: A Thermal Resistance and Impedance Calculator for Electronic Packages," Energies, MDPI, vol. 13(9), pages 1-16, May.
    • Handle: RePEc:gam:jeners:v:13:y:2020:i:9:p:2252-:d:353791
    as

    Download full text from publisher

    File URL: https://www.mdpi.com/1996-1073/13/9/2252/pdf
    Download Restriction: no
    File URL: https://www.mdpi.com/1996-1073/13/9/2252/
    Download Restriction: no
    ---><---

    References listed on IDEAS

    as
    1. Lorenzo Codecasa & Salvatore Race & Vincenzo d’Alessandro & Donata Gualandris & Arianna Morelli & Claudio Maria Villa, 2019. "TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages," Energies, MDPI, vol. 12(6), pages 1-10, March.
    Full references (including those not matched with items on IDEAS)

    Most related items

    These are the items that most often cite the same works as this one and are cited by the same works as this one.

      Corrections

      All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:gam:jeners:v:13:y:2020:i:9:p:2252-:d:353791. See general information about how to correct material in RePEc.

      If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

      If CitEc recognized a bibliographic reference but did not link an item in RePEc to it, you can help with this form .

      If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

      For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: MDPI Indexing Manager (email available below). General contact details of provider: https://www.mdpi.com .

      Please note that corrections may take a couple of weeks to filter through the various RePEc services.

      IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.