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TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages

Author

Listed:
  • Lorenzo Codecasa

    (Department of Electronics, Information and Bioengineering, Politecnico di Milano, 20133 Milan, Italy)

  • Salvatore Race

    (Department of Electrical Engineering and Information Technology, University Federico II, 80125 Naples, Italy)

  • Vincenzo d’Alessandro

    (Department of Electrical Engineering and Information Technology, University Federico II, 80125 Naples, Italy)

  • Donata Gualandris

    (STMicroelectronics, 20864 Agrate Brianza, Italy)

  • Arianna Morelli

    (STMicroelectronics, 20864 Agrate Brianza, Italy)

  • Claudio Maria Villa

    (STMicroelectronics, 20864 Agrate Brianza, Italy)

Abstract

This paper presents a novel simulation tool named thermal resistance advanced calculator (TRAC). Such a tool allows the straightforward definition of a parametric detailed thermal model of electronic packages with Manhattan geometry, in which the key geometrical details and thermal properties can vary in a chosen set. Additionally, it can apply a novel model-order reduction-based approach for the automatic and fast extraction of a parametric compact thermal model of such packages. Furthermore, it is suited to automatically determine the joint electron device engineering council (JEDEC) thermal metrics for any choice of parameters in a negligible amount of time. The tool was validated through the analysis of two families of quad flat packages.

Suggested Citation

  • Lorenzo Codecasa & Salvatore Race & Vincenzo d’Alessandro & Donata Gualandris & Arianna Morelli & Claudio Maria Villa, 2019. "TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages," Energies, MDPI, vol. 12(6), pages 1-10, March.
    • Handle: RePEc:gam:jeners:v:12:y:2019:i:6:p:1050-:d:215071
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    Citations

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    Cited by:

    1. Lorenzo Codecasa & Francesca De Viti & Vincenzo d’Alessandro & Donata Gualandris & Arianna Morelli & Claudio Maria Villa, 2020. "TRIC: A Thermal Resistance and Impedance Calculator for Electronic Packages," Energies, MDPI, vol. 13(9), pages 1-16, May.

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