IDEAS home Printed from https://ideas.repec.org/a/gam/jeners/v12y2019i11p2080-d235938.html
   My bibliography  Save this article

Reliability Investigation of a Carbon Nanotube Array Thermal Interface Material

Author

Listed:
  • Andreas Nylander

    (Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology, Kemivägen 9, 412 58 Göteborg, Sweden)

  • Josef Hansson

    (Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology, Kemivägen 9, 412 58 Göteborg, Sweden)

  • Majid Kabiri Samani

    (Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology, Kemivägen 9, 412 58 Göteborg, Sweden)

  • Christian Chandra Darmawan

    (SHT Smart High Tech AB, Kemivägen 6, 412 58 Göteborg, Sweden)

  • Ana Borta Boyon

    (Thales Research and Technology - France, Campus Polytechnique 1, avenue Augustin Fresnel, 91767 Palaiseau cedex, France)

  • Laurent Divay

    (Thales Research and Technology - France, Campus Polytechnique 1, avenue Augustin Fresnel, 91767 Palaiseau cedex, France)

  • Lilei Ye

    (SHT Smart High Tech AB, Kemivägen 6, 412 58 Göteborg, Sweden)

  • Yifeng Fu

    (Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology, Kemivägen 9, 412 58 Göteborg, Sweden)

  • Afshin Ziaei

    (Thales Research and Technology - France, Campus Polytechnique 1, avenue Augustin Fresnel, 91767 Palaiseau cedex, France)

  • Johan Liu

    (Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology, Kemivägen 9, 412 58 Göteborg, Sweden)

Abstract

As feature density increases within microelectronics, so does the dissipated power density, which puts an increased demand on thermal management. Thermal interface materials (TIMs) are used at the interface between contacting surfaces to reduce the thermal resistance, and is a critical component within many electronics systems. Arrays of carbon nanotubes (CNTs) have gained significant interest for application as TIMs, due to the high thermal conductivity, no internal thermal contact resistances and an excellent conformability. While studies show excellent thermal performance, there has to date been no investigation into the reliability of CNT array TIMs. In this study, CNT array TIMs bonded with polymer to close a Si-Cu interface were subjected to thermal cycling. Thermal interface resistance measurements showed a large degradation of the thermal performance of the interface within the first 100 cycles. More detailed thermal investigation of the interface components showed that the connection between CNTs and catalyst substrate degrades during thermal cycling even in the absence of thermal expansion mismatch, and the nature of this degradation was further analyzed using X-ray photoelectron spectroscopy. This study indicates that the reliability will be an important consideration for further development and commercialization of CNT array TIMs.

Suggested Citation

  • Andreas Nylander & Josef Hansson & Majid Kabiri Samani & Christian Chandra Darmawan & Ana Borta Boyon & Laurent Divay & Lilei Ye & Yifeng Fu & Afshin Ziaei & Johan Liu, 2019. "Reliability Investigation of a Carbon Nanotube Array Thermal Interface Material," Energies, MDPI, vol. 12(11), pages 1-10, May.
  • Handle: RePEc:gam:jeners:v:12:y:2019:i:11:p:2080-:d:235938
    as

    Download full text from publisher

    File URL: https://www.mdpi.com/1996-1073/12/11/2080/pdf
    Download Restriction: no

    File URL: https://www.mdpi.com/1996-1073/12/11/2080/
    Download Restriction: no
    ---><---

    References listed on IDEAS

    as
    1. Haoxue Han & Yong Zhang & Nan Wang & Majid Kabiri Samani & Yuxiang Ni & Zainelabideen Y. Mijbil & Michael Edwards & Shiyun Xiong & Kimmo Sääskilahti & Murali Murugesan & Yifeng Fu & Lilei Ye & Hatef S, 2016. "Functionalization mediates heat transport in graphene nanoflakes," Nature Communications, Nature, vol. 7(1), pages 1-9, September.
    2. Sumanjeet Kaur & Nachiket Raravikar & Brett A. Helms & Ravi Prasher & D. Frank Ogletree, 2014. "Enhanced thermal transport at covalently functionalized carbon nanotube array interfaces," Nature Communications, Nature, vol. 5(1), pages 1-8, May.
    Full references (including those not matched with items on IDEAS)

    Most related items

    These are the items that most often cite the same works as this one and are cited by the same works as this one.
    1. Fasano, Matteo & Bozorg Bigdeli, Masoud & Vaziri Sereshk, Mohammad Rasool & Chiavazzo, Eliodoro & Asinari, Pietro, 2015. "Thermal transmittance of carbon nanotube networks: Guidelines for novel thermal storage systems and polymeric material of thermal interest," Renewable and Sustainable Energy Reviews, Elsevier, vol. 41(C), pages 1028-1036.
    2. Ke Zhan & Yucong Chen & Zhiyuan Xiong & Yulun Zhang & Siyuan Ding & Fangzheng Zhen & Zhenshi Liu & Qiang Wei & Minsu Liu & Bo Sun & Hui-Ming Cheng & Ling Qiu, 2024. "Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge," Nature Communications, Nature, vol. 15(1), pages 1-12, December.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:gam:jeners:v:12:y:2019:i:11:p:2080-:d:235938. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    If CitEc recognized a bibliographic reference but did not link an item in RePEc to it, you can help with this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: MDPI Indexing Manager (email available below). General contact details of provider: https://www.mdpi.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.