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Interconnect Reliability in Advanced Memory Device Packaging
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Abstract
Individual chapters are listed in the "Chapters" tab
Suggested Citation
DOI: 10.1007/978-3-031-26708-6
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Book Chapters
The following chapters of this book are listed in IDEAS- Chong Leong, Gan & Chen-Yu, Huang, 2023. "Advanced Memory and Device Packaging," Springer Series in Reliability Engineering, in: Interconnect Reliability in Advanced Memory Device Packaging, chapter 0, pages 1-19, Springer.
- Chong Leong, Gan & Chen-Yu, Huang, 2023. "Wearout Reliability-Based Characterization in Memory Packaging," Springer Series in Reliability Engineering, in: Interconnect Reliability in Advanced Memory Device Packaging, chapter 0, pages 21-44, Springer.
- Chong Leong, Gan & Chen-Yu, Huang, 2023. "Recycling of Noble Metals Used in Memory Packaging," Springer Series in Reliability Engineering, in: Interconnect Reliability in Advanced Memory Device Packaging, chapter 0, pages 45-66, Springer.
- Chong Leong, Gan & Chen-Yu, Huang, 2023. "Advanced Flip Chip Packaging," Springer Series in Reliability Engineering, in: Interconnect Reliability in Advanced Memory Device Packaging, chapter 0, pages 67-94, Springer.
- Chong Leong, Gan & Chen-Yu, Huang, 2023. "Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD)," Springer Series in Reliability Engineering, in: Interconnect Reliability in Advanced Memory Device Packaging, chapter 0, pages 95-117, Springer.
- Chong Leong, Gan & Chen-Yu, Huang, 2023. "Specific Packaging Reliability Testing," Springer Series in Reliability Engineering, in: Interconnect Reliability in Advanced Memory Device Packaging, chapter 0, pages 119-151, Springer.
- Chong Leong, Gan & Chen-Yu, Huang, 2023. "Reliability Simulation and Modeling in Memory Packaging," Springer Series in Reliability Engineering, in: Interconnect Reliability in Advanced Memory Device Packaging, chapter 0, pages 153-184, Springer.
- Chong Leong, Gan & Chen-Yu, Huang, 2023. "Interconnects Reliability for Future Cryogenic Memory Applications," Springer Series in Reliability Engineering, in: Interconnect Reliability in Advanced Memory Device Packaging, chapter 0, pages 185-207, Springer.
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