Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
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Abstract
Individual chapters are listed in the "Chapters" tab
Suggested Citation
DOI: 10.1007/978-0-85729-310-7
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Book Chapters
The following chapters of this book are listed in IDEAS- Cher Ming Tan & Zhenghao Gan & Wei Li & Yuejin Hou, 2011. "Introduction," Springer Series in Reliability Engineering, in: Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections, edition 1, chapter 0, pages 1-3, Springer.
- Cher Ming Tan & Zhenghao Gan & Wei Li & Yuejin Hou, 2011. "Development of Physics-Based Modeling for ULSI Interconnections Failure Mechanisms: Electromigration and Stress-Induced Voiding," Springer Series in Reliability Engineering, in: Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections, edition 1, chapter 0, pages 5-38, Springer.
- Cher Ming Tan & Zhenghao Gan & Wei Li & Yuejin Hou, 2011. "Introduction and General Theory of Finite Element Method," Springer Series in Reliability Engineering, in: Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections, edition 1, chapter 0, pages 39-71, Springer.
- Cher Ming Tan & Zhenghao Gan & Wei Li & Yuejin Hou, 2011. "Finite Element Method for Electromigration Study," Springer Series in Reliability Engineering, in: Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections, edition 1, chapter 0, pages 73-112, Springer.
- Cher Ming Tan & Zhenghao Gan & Wei Li & Yuejin Hou, 2011. "Finite Element Method for Stress-Induced Voiding," Springer Series in Reliability Engineering, in: Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections, edition 1, chapter 0, pages 113-130, Springer.
- Cher Ming Tan & Zhenghao Gan & Wei Li & Yuejin Hou, 2011. "Finite Element Method for Dielectric Reliability," Springer Series in Reliability Engineering, in: Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections, edition 1, chapter 0, pages 131-145, Springer.
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