Author
Listed:
- HONGXIA LI
(Lab of Electronic Materials and Devices, Hangzhou Dianzi University, Hangzhou 310018, P. R. China)
- XIAOJUN LV
(Lab of Electronic Materials and Devices, Hangzhou Dianzi University, Hangzhou 310018, P. R. China)
- JUNHUA XI
(Lab of Electronic Materials and Devices, Hangzhou Dianzi University, Hangzhou 310018, P. R. China;
State Key Lab of Silicon Materials, Zhejiang University, Hangzhou 310027, P. R. China)
- XIN WU
(School of Mechanical Engineering, Hangzhou Dianzi University, Hangzhou 310018, P. R. China)
- QINAN MAO
(Lab of Electronic Materials and Devices, Hangzhou Dianzi University, Hangzhou 310018, P. R. China)
- QINGMIN LIU
(School of Mechanical Engineering, Hangzhou Dianzi University, Hangzhou 310018, P. R. China)
- ZHENGUO JI
(Lab of Electronic Materials and Devices, Hangzhou Dianzi University, Hangzhou 310018, P. R. China;
State Key Lab of Silicon Materials, Zhejiang University, Hangzhou 310027, P. R. China)
Abstract
In this paper, we fabricatedPt/TiOx/ZnO/n+-Sistructures by insertingTiOxinterlayer betweenPttop electrode (TE) andZnOthin film for non-volatile resistive random access memory (ReRAM) applications. Effects ofTiOxinterlayer with different thickness on the resistance switching ofPt/TiOx/ZnO/n+-Sistructures were investigated. Conduction behaviors in high and low resistance state (HRS and LRS) fit well with the trap-controlled space-charge-limited conduction (SCLC) and Ohmic behavior, respectively. Variations of set and reset voltages and HRS and LRS resistances ofPt/TiOx/ZnO/n+-Sistructures were investigated as a function ofTiOxthickness. Switching cycling tests were attempted to evaluate the endurance reliability ofPt/TiOx/ZnO/n+-Sistructures. Additionally, the switching mechanism was analyzed by the filament model.
Suggested Citation
Hongxia Li & Xiaojun Lv & Junhua Xi & Xin Wu & Qinan Mao & Qingmin Liu & Zhenguo Ji, 2014.
"EFFECTS OFTiOxINTERLAYER ON RESISTANCE SWITCHING OFPt/TiOx/ZnO/n+-SiSTRUCTURES,"
Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 21(05), pages 1-6.
Handle:
RePEc:wsi:srlxxx:v:21:y:2014:i:05:n:s0218625x14500619
DOI: 10.1142/S0218625X14500619
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