IDEAS home Printed from https://ideas.repec.org/a/wsi/srlxxx/v20y2013i03n04ns0218625x13500236.html
   My bibliography  Save this article

EVOLUTION OF THE COPPER SURFACE IN THE COURSE OF OXIDATION BYCCl4–L(L=THF, DMF, DMSO): SCANNING PROBE MICROSCOPE STUDY

Author

Listed:
  • S. V. PANTELEEV

    (Chemistry Research Institute, N.I. Lobachevsky State University of Nizhny Novgorod, 23/5 Gagarin Avenue, Nizhny Novgorod 603950, Russia)

  • S. V. MASLENNIKOV

    (Chemistry Research Institute, N.I. Lobachevsky State University of Nizhny Novgorod, 23/5 Gagarin Avenue, Nizhny Novgorod 603950, Russia)

  • S. K. IGNATOV

    (Chemistry Research Institute, N.I. Lobachevsky State University of Nizhny Novgorod, 23/5 Gagarin Avenue, Nizhny Novgorod 603950, Russia)

  • I. V. SPIRINA

    (Chemistry Research Institute, N.I. Lobachevsky State University of Nizhny Novgorod, 23/5 Gagarin Avenue, Nizhny Novgorod 603950, Russia)

  • M. V. KRUGLOVA

    (Research and Education Center "The Physics of Solid-State Nanostructure" of Nizhny Novgorod State University, 23/3 Gagarin Avenue, Nizhny Novgorod 603950, Russia)

  • B. A. GRIBKOV

    (Institute for Physics of Microstructures Russian Academy Sciences, GSP-105, Nizhny Novgorod 603950, Russia)

  • S. N. VDOVICHEV

    (Institute for Physics of Microstructures Russian Academy Sciences, GSP-105, Nizhny Novgorod 603950, Russia)

Abstract

The evolution of compact surface of the 100 nm copper film deposited on the glass-ceramics doped with vanadium coating in the course of the oxidation by theCCl4–L(L = dimethylformamide (DMF), tetrahydrofuran (THF), dimethylsulfoxide (DMSO),CCl4concentration ≈ 1 mol/L) was studied by atomic force microscopy (AFM) in contact mode. The dynamics of active centers formation and destruction was investigated in the course of the oxidation process. The metallic sample dissolution rate was estimated as a function of the coordinating solvent nature. The development of the metal surface oxidation was established to lead to a significant increase of surface roughness. This phenomenon can be explained by the fact that different parts of the surface react at different rates. Further course of the reaction leads to a significant decrease of the surface roughness of copper films. The amount of the metal reacted has an almost linear dependence on the reaction time. AFM scans indicate that there is the same mechanism of the reaction between copper and carbon tetrachloride for all solvents.

Suggested Citation

  • S. V. Panteleev & S. V. Maslennikov & S. K. Ignatov & I. V. Spirina & M. V. Kruglova & B. A. Gribkov & S. N. Vdovichev, 2013. "EVOLUTION OF THE COPPER SURFACE IN THE COURSE OF OXIDATION BYCCl4–L(L=THF, DMF, DMSO): SCANNING PROBE MICROSCOPE STUDY," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 20(03n04), pages 1-16.
    • Handle: RePEc:wsi:srlxxx:v:20:y:2013:i:03n04:n:s0218625x13500236
    DOI: 10.1142/S0218625X13500236
    as

    Download full text from publisher

    File URL: http://www.worldscientific.com/doi/abs/10.1142/S0218625X13500236
    Download Restriction: Access to full text is restricted to subscribers
    File URL: https://libkey.io/10.1142/S0218625X13500236?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:wsi:srlxxx:v:20:y:2013:i:03n04:n:s0218625x13500236. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Tai Tone Lim (email available below). General contact details of provider: http://www.worldscinet.com/srl/srl.shtml .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.