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Morphology, Thermal Stability, And Solderability Of Electroless Nickel–Phosphorus Plating Layer

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  • JEONG-WON YOON

    (School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea)

  • HYUN-SUK CHUN

    (School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea)

  • HAN-BYUL KANG

    (School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea)

  • MIN-HO PARK

    (School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea)

  • CHEOL-WOONG YANG

    (School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea)

  • HOO-JEONG LEE

    (School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea)

  • SEUNG-BOO JUNG

    (School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea)

Abstract

We studied the growth kinetics and characteristics of electroless nickel–phosphorus (EN–P) deposition layer onCusubstrate in an acid plating bath with sodium hypophosphite as the reducing agent. The individual nodules of the EN–P layer increased in size but decreased in number with increasing plating time and pH, i.e. the root-mean-square (RMS) roughness of the EN deposit decreased. In addition, the plating rate of the EN layer increased with increasing plating bath pH. X-ray diffraction (XRD) analyses revealed that the as-plated deposit was in an amorphous phase, while the heat-treated layer was composed of crystallizedNiandNi3Pcompound. The solderability of the EN layer increased with decreasingPcontent. In addition, the wetting force increased with increasing surface roughness. The present study clearly showed that the solderability behavior of the EN layer is affected by both surface composition (Pcontent) and morphology.

Suggested Citation

  • Jeong-Won Yoon & Hyun-Suk Chun & Han-Byul Kang & Min-Ho Park & Cheol-Woong Yang & Hoo-Jeong Lee & Seung-Boo Jung, 2007. "Morphology, Thermal Stability, And Solderability Of Electroless Nickel–Phosphorus Plating Layer," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 14(04), pages 827-832.
    • Handle: RePEc:wsi:srlxxx:v:14:y:2007:i:04:n:s0218625x07010111
    DOI: 10.1142/S0218625X07010111
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