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Constructing and Realising an Employment Platform for Slash Youth in the Age of Digital Intelligence

Author

Listed:
  • Xue Xiang

    (Department of Tourism and Management, Wuhan College of Foreign Languages & Foreign Affairs, Wuhan 430083, P. R. China)

Abstract

The current employment environment is becoming increasingly complex, with many job seekers competing with each other in more concentrated and narrower fields, worsening the job market as well as inhibiting the career potential of job seekers. There is a need to provide better employment guidance and employment quality assessment for slash youth. This study attempts to design a job recommendation model for slash youths by combining an improved collaborative filtering algorithm and a dynamic bilateral matching algorithm (BMA). The test results show that the precision rate of the BMA is always the largest with the increase of the number of clusters, with the highest value reaching 90.04%; the average ranking inverse curve of bilateral matching has the fastest growth rate, with the maximum value of 62.04%, which is 34.26% and 10.06% higher than the other two maximum values, and the optimal number of clusters is set to 24. The highest precision rate of the algorithm is 82.17% when the number of recommendations is 10. The algorithm also performed better in terms of recommendation diversity, with a maximum value of around 0.28. The recommendation success rate and satisfaction value reached 87.72% and 47.86%, respectively. The recommendation precision of the model designed in this study is high. It is conducive to solving problems such as difficulty in recruiting and finding jobs, and promotes the healthy development of the recruitment market.

Suggested Citation

  • Xue Xiang, 2024. "Constructing and Realising an Employment Platform for Slash Youth in the Age of Digital Intelligence," Journal of Information & Knowledge Management (JIKM), World Scientific Publishing Co. Pte. Ltd., vol. 23(05), pages 1-19, October.
  • Handle: RePEc:wsi:jikmxx:v:23:y:2024:i:05:n:s0219649224500709
    DOI: 10.1142/S0219649224500709
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