Strain effects on the behavior of intrinsic point defects within the GaN/AlN interface

Defect behaviors in GaN-based compounds studied by using density functional theory have exhibited widely practical applications for optoelectronic devices. Ga is usually used to solubilize in AlN to release the lattice mismatch and the interface strain. In this study, we investigate the formation energies and diffusion barriers of intrinsic point defects within the GaN/AlN interface. The intrinsic defect with the lowest formation energy is positively charged N vacancy, and negatively charged Ga vacancy is the defect with second lower formation energy. Compared with the case in bulk GaN, the GaN/AlN interface promotes the generation of Ga vacancy and inhibits the generation of N vacancy. Meanwhile, the defect diffusion barrier of N vacancy within the GaN/AlN interface is higher than that in the bulk GaN. The hydrostatic compressive/ tensile strain significantly promotes the generation of these two vacancy defects, while biaxial tensile strain and the biaxial compressive strain slightly promote and inhibit the generation of these two vacancy defects, respectively. These interface and strain effects provide the significant information in understanding the electrical properties of GaN-based devices, especially under the extreme conditions. Our work therefore not only elucidates defect behaviors under different strains in GaN/AlN interface, but also paves the way for understanding and designing promising electronic devices with interface engineering.