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Transient nanofluid squeezing cooling process using aluminum oxide nanoparticle

Author

Listed:
  • Iskander Tlili

    (Department for Management of Science and Technology Development, Ton Duc Thang University, Ho Chi Minh City, Vietnam2Faculty of Applied Sciences, Ton Duc Thang University, Ho Chi Minh City, Vietnam)

  • R. Moradi

    (Department of Chemical Engineering, School of Engineering and Applied Science, Khazar University, Baku, Azerbaijan)

  • M. Barzegar Gerdroodbary

    (Department of Mechanical Engineering, Babol Noshirvani University of Technology, Babol, Iran)

Abstract

Computational studies have been widely applied for the thermal evaluation of the nanomaterial thermal feature in different industrial and scientific issues. The squeezed flow and heat transfer features for Al2O3-water nanofluid among analogous plates are investigated using the GOHAM and its validity is verified by comparison with existing numerical results. Novel aspects of Brownian motion and thermal force were accounted in the simulation of nanomaterial flow within parallel plate. Analytical investigation has been done for diverse governing factors namely: the squeeze, chemical reaction factors and Eckert number. The obtained outcomes show that |Cf| has direct relationship with absolute values of squeeze factor. Nu increases for large Eckert number and absolute values of squeeze number.

Suggested Citation

  • Iskander Tlili & R. Moradi & M. Barzegar Gerdroodbary, 2019. "Transient nanofluid squeezing cooling process using aluminum oxide nanoparticle," International Journal of Modern Physics C (IJMPC), World Scientific Publishing Co. Pte. Ltd., vol. 30(11), pages 1-12, November.
    • Handle: RePEc:wsi:ijmpcx:v:30:y:2019:i:11:n:s0129183119500785
    DOI: 10.1142/S0129183119500785
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    Cited by:

    1. Li, Zhixiong & Manh, Tran Dinh & Barzegar Gerdroodbary, Mostafa & Nam, Nguyen Dang & Moradi, R. & Babazadeh, Houman, 2020. "The effect of sinusoidal wall on hydrogen jet mixing rate considering supersonic flow," Energy, Elsevier, vol. 193(C).

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