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A Hybrid, Quantum-Classical Approach For The Computation Of Dislocation Properties In Real Materials: Method, Limitations And Applications

Author

Listed:
  • FRANCESCA TAVAZZA

    (National Institute of Standards and Technology, 100 Bureau Drive, Gaithersburg, MD 20899, USA)

  • LYLE E. LEVINE

    (National Institute of Standards and Technology, 100 Bureau Drive, Gaithersburg, MD 20899, USA)

  • ANNE M. CHAKA

    (National Institute of Standards and Technology, 100 Bureau Drive, Gaithersburg, MD 20899, USA)

Abstract

In this work we introduce a hybridab initio-classical simulation methodology designed to incorporate the chemistry into the description of phenomena that, intrinsically, require very large systems to be properly described. This hybrid approach allows us to conduct large-scale atomistic simulations with a simple classical potential (embedded atom method (EAM), for instance) while simultaneously using a more accurateab initioapproach for critical embedded regions. The coupling is made through shared atomic shells where the two atomistic modeling approaches are relaxed in an iterative, self-consistent manner. The magnitude of the incompatibility forces arising in the shared shell is analyzed, and possible terminations for the embedded region are discussed, as a way to reduce such forces. As a test case, the formation energy of a single vacancy in aluminum at different distances from an edge dislocation is studied. Results obtained using the hybrid approach are compared to those obtained using classical methods alone, and the range of validity for the classical approach is evaluated.

Suggested Citation

  • Francesca Tavazza & Lyle E. Levine & Anne M. Chaka, 2009. "A Hybrid, Quantum-Classical Approach For The Computation Of Dislocation Properties In Real Materials: Method, Limitations And Applications," International Journal of Modern Physics C (IJMPC), World Scientific Publishing Co. Pte. Ltd., vol. 20(09), pages 1399-1409.
  • Handle: RePEc:wsi:ijmpcx:v:20:y:2009:i:09:n:s0129183109014461
    DOI: 10.1142/S0129183109014461
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